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TLV320AIC3206RSBR

Texas Instruments

TLV320AIC3206RSBR by Texas Instruments

TLV320AIC3206RSBR by Texas Instruments is a 40-terminal PCM CODEC in a square chip carrier package. It features surface mount technology and no-lead terminals, making it ideal for audio applications requiring high-quality signal processing and transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,209 parts In-Stock

1+ parts

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5,209

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Digiode

USA . 4,826 parts In-Stock

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4,826

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 529 parts In-Stock

1+ parts

$5.511

100+ parts

-

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529

$5.511

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Parana Technologies

USA . 882 parts In-Stock

1+ parts

$7.727

100+ parts

-

1k+ parts

$8.261

10k+ parts

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882

$7.727

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$8.261

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DigiPath Technology Company

USA . 665 parts In-Stock

1+ parts

$8.508

100+ parts

-

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665

$8.508

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ChromeModa Solutions

Germany . 4,699 parts In-Stock

1+ parts

$8.682

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$7.119

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4,699

$8.682

$7.119

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IDEA Electronic Components Group

UK . 1,722 parts In-Stock

1+ parts

$8.682

100+ parts

$8.248

1k+ parts

$7.814

10k+ parts

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1,722

$8.682

$8.248

$7.814

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One Stop Electronics

USA . 627 parts In-Stock

1+ parts

$397.000

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627

$397.000

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Corphita

USA . 2,902 parts In-Stock

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2,902

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Overview

Unlock the power of crystal-clear audio with the TLV320AIC3206RSBR by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This Audio Codec is perfect for applications in telecommunications, audio systems, and more. Experience the seamless integration and advanced features that this product offers, providing customers with unparalleled value and benefits. Elevate your audio experience with the TLV320AIC3206RSBR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the audio codec suitable for various applications while ensuring a long lifespan.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and space in electronic devices.

Package Shape: SQUARE

The square package shape provides a compact design, ideal for space-constrained applications without compromising on performance.

No. of Terminals: 40

Having 40 terminals allows for versatile connectivity options, enabling compatibility with a wide range of devices and systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced thermal performance and improved signal integrity, ensuring reliable operation in demanding environments.

Terminal Position: QUAD

The quad terminal position facilitates easy connection and soldering, simplifying the assembly process and enhancing overall product reliability.

Terminal Form: NO LEAD

The absence of lead terminals eliminates potential environmental hazards and health risks associated with lead-based components, contributing to a more eco-friendly design.

Telecom IC Type: PCM CODEC

Being a PCM codec ensures high-quality audio encoding and decoding capabilities, making this product an excellent choice for telecommunications and audio processing applications.

Technical Specifications

Audio Codecs TLV320AIC3206RSBR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

No. of Terminals:

40

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

TLV320AIC3206RSBR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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