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TLV320AC41CDWR

Texas Instruments

TLV320AC41CDWR by Texas Instruments

TLV320AC41CDWR by Texas Instruments is a 20-terminal PCM CODEC with A-LAW companding law. Operating at 0-70°C, it has a 3V supply voltage and consumes 7.5mA max current. Ideal for audio applications, this small outline package supports synchronous/asynchronous modes in telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,976 parts In-Stock

1+ parts

-

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7,976

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Digiode

USA . 934 parts In-Stock

1+ parts

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934

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 339 parts In-Stock

1+ parts

$6.477

100+ parts

-

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339

$6.477

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Parana Technologies

USA . 2,335 parts In-Stock

1+ parts

$11.928

100+ parts

-

1k+ parts

$12.331

10k+ parts

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2,335

$11.928

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$12.331

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DigiPath Technology Company

USA . 573 parts In-Stock

1+ parts

$13.134

100+ parts

$12.083

1k+ parts

-

10k+ parts

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573

$13.134

$12.083

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ChromeModa Solutions

Germany . 6,933 parts In-Stock

1+ parts

$13.402

100+ parts

$10.990

1k+ parts

-

10k+ parts

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6,933

$13.402

$10.990

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IDEA Electronic Components Group

UK . 808 parts In-Stock

1+ parts

$13.402

100+ parts

$12.732

1k+ parts

$12.062

10k+ parts

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808

$13.402

$12.732

$12.062

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One Stop Electronics

USA . 1,621 parts In-Stock

1+ parts

$644.000

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1,621

$644.000

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Corphita

USA . 4,739 parts In-Stock

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4,739

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Overview

Enhance your audio systems with the TLV320AC41CDWR by Texas Instruments, a top-tier manufacturer known for delivering high-quality audio codecs. Perfect for a wide range of applications, this PCM CODEC offers unrivaled performance and reliability. With its small outline package and synchronous/asynchronous operating mode, it provides seamless integration and superior sound quality. Upgrade your audio experience today with the TLV320AC41CDWR and enjoy unparalleled value and benefits that only Texas Instruments can offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mounting makes installation easier and more efficient, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The flexibility of operating in both synchronous and asynchronous modes allows for compatibility with a variety of systems and applications.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options, allowing for versatile integration with other components.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature means the product can function in a wide range of environments, from cold to hot.

Companding Law: A-LAW

A-Law companding law ensures high-quality audio compression, delivering clear and accurate sound reproduction.

Technology: CMOS

The CMOS technology offers low power consumption and enhanced performance, making the product energy-efficient and reliable.

Maximum Supply Current: 7.5 mA

The low maximum supply current helps save energy and reduces the risk of overheating, increasing the lifespan of the product.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is a common and stable power source, ensuring consistent performance of the product.

Technical Specifications

Audio Codecs TLV320AC41CDWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TLV320AC41CDWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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