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TP13057ADWR

Texas Instruments

TP13057ADWR by Texas Instruments

TP13057ADWR by Texas Instruments is a PCM CODEC with A-LAW companding law, operating at -40 to 85 °C. It has +-5V power supplies, 16 terminals in a small outline package for industrial applications. The audio codec features synchronous/asynchronous modes and gull wing terminal form for telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,826 parts In-Stock

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5,826

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Digiode

USA . 4,012 parts In-Stock

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4,012

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

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2

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Distributors (Availability)

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AZTECH Wire

Italy . 643 parts In-Stock

1+ parts

$7.022

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643

$7.022

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Parana Technologies

USA . 1,031 parts In-Stock

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$10.515

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-

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$11.024

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1,031

$10.515

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$11.024

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DigiPath Technology Company

USA . 1,157 parts In-Stock

1+ parts

$11.579

100+ parts

$10.652

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1,157

$11.579

$10.652

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ChromeModa Solutions

Germany . 2,947 parts In-Stock

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$11.815

100+ parts

$9.688

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2,947

$11.815

$9.688

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IDEA Electronic Components Group

UK . 258 parts In-Stock

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$11.815

100+ parts

$11.224

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$10.634

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258

$11.815

$11.224

$10.634

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One Stop Electronics

USA . 530 parts In-Stock

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$532.000

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530

$532.000

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Lixinc

USA . 13,546 parts In-Stock

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13,546

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Corphita

USA . 298 parts In-Stock

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298

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Overview

Experience superior audio quality and reliable performance with the TP13057ADWR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Audio Codecs like no other. This versatile product is perfect for a wide range of applications, providing unmatched value and benefits to customers. Elevate your audio experience and trust in the quality and advantages that Texas Instruments brings to the table with the TP13057ADWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface-mountable makes installation easier and more convenient, especially in compact devices where space is limited.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes adds versatility and compatibility with different system configurations.

Power Supplies (V): +-5

The dual power supplies of +-5V provide stable and reliable power to the codec, ensuring consistent performance and output.

No. of Terminals: 16

Having a sufficient number of terminals allows for easy connectivity and integration with other components in the circuit.

Companding Law: A-LAW

The A-Law companding law helps in efficient compression and expansion of audio signals, maintaining high-quality audio output.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the codec can operate reliably in a wide range of temperature conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the codec energy-efficient and reliable in noisy environments.

Filter: YES

The presence of a filter helps in removing unwanted noise and disturbances from the audio signal, resulting in a cleaner and clearer output.

Technical Specifications

Audio Codecs TP13057ADWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TP13057ADWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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