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5962-9086303MXX

Texas Instruments

5962-9086303MXX by Texas Instruments

The Texas Instruments 5962-9086303MXX is an Audio Codec with synchronous/asynchronous operation, CMOS technology, and quad terminal position. It features a ceramic/metal-sealed cofired package body material and is ideal for telecom applications requiring PCM encoding/decoding. Operating temperature ranges from -40 to 85°C, making it suitable for industrial use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,962 parts In-Stock

1+ parts

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6,962

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Digiode

USA . 2,123 parts In-Stock

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2,123

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 869 parts In-Stock

1+ parts

$12.457

100+ parts

-

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869

$12.457

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Parana Technologies

USA . 279 parts In-Stock

1+ parts

$13.798

100+ parts

$1,281.323

1k+ parts

$12.418

10k+ parts

-

279

$13.798

$1,281.323

$12.418

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DigiPath Technology Company

USA . 830 parts In-Stock

1+ parts

$15.193

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830

$15.193

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ChromeModa Solutions

Germany . 5,036 parts In-Stock

1+ parts

$15.503

100+ parts

$12.712

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5,036

$15.503

$12.712

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IDEA Electronic Components Group

UK . 435 parts In-Stock

1+ parts

$15.503

100+ parts

$14.728

1k+ parts

$13.953

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435

$15.503

$14.728

$13.953

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Native Components

USA . 134 parts In-Stock

1+ parts

$43.554

100+ parts

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$41.812

134

$43.554

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$41.812

Northwest PG Solutions

USA . 808 parts In-Stock

1+ parts

$47.909

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808

$47.909

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One Stop Electronics

USA . 371 parts In-Stock

1+ parts

$584.000

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371

$584.000

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Corphita

USA . 2,582 parts In-Stock

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2,582

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Overview

Looking for top-notch audio codecs that deliver exceptional performance? Look no further than the 5962-9086303MXX by Texas Instruments. Renowned for their high-quality manufacturing standards, Texas Instruments produces cutting-edge technology that exceeds industry standards. Ideal for a wide range of applications, this PCM codec offers unparalleled value and benefits to customers. Upgrade your audio system with confidence and experience the superior quality that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability of the product, making it suitable for a variety of applications in different environments.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in use, allowing for seamless integration into different systems and setups.

No. of Terminals: 28

The high number of terminals allows for more connectivity options, enabling the product to handle complex audio codec functions efficiently.

Package Style (Meter): CHIP CARRIER

The chip carrier package style makes the product compact and space-efficient, ideal for applications where size is a constraint.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can perform reliably even in harsh environmental conditions with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can function effectively in cold environments without any performance issues.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, reducing the risk of signal loss or interference in the audio codec system.

Maximum Seated Height: 2.03 mm

The low maximum seated height allows for easy integration of the product into compact electronic devices or systems with limited space.

Width: 11.43 mm

The moderate width of the product ensures compatibility with standard electronic components and facilitates easy installation and mounting.

Length: 11.43 mm

The moderate length of the product makes it suitable for various electronic applications without requiring additional space or modifications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand demanding industrial environments with consistent performance and reliability.

Technology: CMOS

The use of CMOS technology enables low power consumption and high-speed operation, making the product energy-efficient and suitable for high-performance audio codec applications.

Telecom IC Type: PCM CODEC

Being a PCM codec, the product is capable of converting analog audio signals into digital format with high accuracy and fidelity, essential for telecommunication applications.

Terminal Pitch: 1.27 mm

The precise terminal pitch of 1.27 mm allows for easy soldering and connection of the product, ensuring reliable signal transmission in the audio codec system.

Filter: YES

The presence of a filter in the product helps in removing noise and interference from the audio signals, resulting in clear and high-quality audio output.

Technical Specifications

Audio Codecs 5962-9086303MXX attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

Length:

11.43 mm

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

5962-9086303MXX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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