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TCM38C17DGG

Texas Instruments

TCM38C17DGG by Texas Instruments

TCM38C17DGG by Texas Instruments is a PCM CODEC with 4 functions, operating at 5V. It features A/MU-LAW companding law, industrial temperature grade, and CMOS technology. This Audio Codec has a small outline package style and is suitable for telecom applications requiring precise filtering at temperatures ranging from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,840 parts In-Stock

1+ parts

-

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1k+ parts

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4,840

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Vyrian

USA . 2,874 parts In-Stock

1+ parts

-

100+ parts

-

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2,874

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 655 parts In-Stock

1+ parts

$11.841

100+ parts

-

1k+ parts

$12.242

10k+ parts

-

655

$11.841

-

$12.242

-

DigiPath Technology Company

USA . 1,342 parts In-Stock

1+ parts

$13.039

100+ parts

$11.996

1k+ parts

-

10k+ parts

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1,342

$13.039

$11.996

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IDEA Electronic Components Group

UK . 1,448 parts In-Stock

1+ parts

$13.305

100+ parts

$12.640

1k+ parts

$11.974

10k+ parts

-

1,448

$13.305

$12.640

$11.974

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ChromeModa Solutions

Germany . 290 parts In-Stock

1+ parts

$13.305

100+ parts

$10.910

1k+ parts

-

10k+ parts

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290

$13.305

$10.910

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AZTECH Wire

Italy . 624 parts In-Stock

1+ parts

$19.162

100+ parts

-

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624

$19.162

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One Stop Electronics

USA . 252 parts In-Stock

1+ parts

$267.000

100+ parts

-

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252

$267.000

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Corphita

USA . 1,501 parts In-Stock

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-

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1,501

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Overview

Experience crystal-clear audio quality like never before with the TCM38C17DGG by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers unparalleled reliability and performance in their audio codecs. Perfect for telecom applications, this compact device boasts four functions in a small outline package, making it ideal for a wide range of industrial settings. Upgrade your audio experience today with the TCM38C17DGG and enjoy the benefits of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the audio codec, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 4

With 4 functions included in this audio codec, it offers versatility and flexibility for different audio processing needs.

Power Supplies (V): 5

Operating at 5 volts ensures a stable power supply for consistent performance and eliminates the need for additional power management.

No. of Terminals: 48

Having 48 terminals enables connectivity to multiple components, facilitating complex audio signal routing and processing.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range from -40°C to 85°C ensures reliability in harsh environments, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the efficiency of the audio codec.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 volts ensures compatibility with standard power sources and simplifies integration into existing systems.

Filter: YES

Having a filter integrated into the audio codec helps to remove unwanted noise and interference, resulting in cleaner audio output.

Technical Specifications

Audio Codecs TCM38C17DGG attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.18 dB

JESD-30 Code:

R-PDSO-G48

Linear Coding:

NOT AVAILABLE

No. of Functions:

4

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Codecs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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