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STW5098BBLR/LF

STMicroelectronics

STW5098BBLR/LF by STMicroelectronics

STW5098BBLR/LF by STMicroelectronics is a compact audio codec featuring a 1.8V nominal voltage and operates in synchronous mode. With a very thin profile (1mm height) and 112 terminals, it’s ideal for telecom applications requiring efficient signal processing. Its temperature range spans -30 °C to 85°C, ensuring reliability in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,498 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,498

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-

-

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Digiode

USA . 1,564 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,564

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Anansix

USA . 144 parts In-Stock

1+ parts

-

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1k+ parts

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144

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,782 parts In-Stock

1+ parts

$14.236

100+ parts

-

1k+ parts

$12.812

10k+ parts

-

1,782

$14.236

-

$12.812

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MKK Technologies

India . 1,886 parts In-Stock

1+ parts

$26.770

100+ parts

-

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10k+ parts

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1,886

$26.770

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DigiPath Technology Company

USA . 1,886 parts In-Stock

1+ parts

$26.770

100+ parts

-

1k+ parts

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10k+ parts

-

1,886

$26.770

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-

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Parana Technologies

USA . 1,097 parts In-Stock

1+ parts

-

100+ parts

$17.021

1k+ parts

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1,097

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$17.021

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Corphita

USA . 861 parts In-Stock

1+ parts

-

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861

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Overview

Experience unmatched audio clarity with the STW5098BBLR/LF from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for seamless integration, this high-performance audio codec elevates your projects with its compact, thin-profile design and robust temperature range. Whether you're enhancing consumer electronics or developing telecom applications, trust STMicroelectronics to deliver quality and reliability that drives your success. Unlock superior sound with ST's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and longevity in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easier integration into compact electronic designs, optimizing space and improving manufacturing efficiency.

No. of Functions: 2

With two functions integrated, this codec can efficiently handle multiple audio processing tasks, reducing the need for additional components.

Package Shape: SQUARE

The square package shape is ideal for effective PCB layout and facilitates better thermal performance.

Operating Mode: SYNCHRONOUS

Synchronous operation provides lower latency in audio processing, which is crucial for high-quality audio applications.

No. of Terminals: 112

A high number of terminals enhances connectivity options, allowing for more advanced features and configurations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch of the package style help to save space on the PCB and contribute to overall system miniaturization.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures the codec can function reliably in a wide range of environments.

Minimum Operating Temperature: -30 °C

Operating at a minimum temperature of -30 °C allows this codec to be used in extreme conditions, making it versatile for various applications.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier soldering and improves the stability of the component in the PCB.

Maximum Seated Height: 1 mm

With a low seated height, this codec is ideal for low-profile designs, enabling sleek and compact architectures.

Width: 5 mm

The compact width of 5 mm is suited for space-constrained designs without sacrificing performance.

Maximum Time At Peak Reflow Temperature (s): 40

Support for a maximum peak reflow time of 40 seconds ensures compatibility with standard assembly processes in manufacturing.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C enhances the assembly process efficiency and solder joint reliability.

Length: 5 mm

The 5 mm length contributes to a compact footprint, making it ideal for portable and handheld devices.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grading means the codec can perform reliably in varied conditions beyond standard consumer electronics.

Terminal Form: BALL

Ball terminal configuration promotes effective solder joint formation and enhances connectivity reliability.

Telecom IC Type: PCM CODEC

Being a PCM codec type, it provides high-quality digital audio conversion, making it perfect for telecommunications applications.

Nominal Supply Voltage: 1.8 V

A low nominal supply voltage of 1.8V ensures minimal power consumption, beneficial for battery-powered devices.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch allows for a dense layout, enabling more functionalities within smaller designs.

Filter: YES

The inclusion of a filter enhances audio performance by reducing noise and improving signal integrity.

Technical Specifications

Audio Codecs STW5098BBLR/LF attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Filter:

YES

JESD-30 Code:

S-PBGA-B112

Length:

5 mm

No. of Functions:

2

No. of Terminals:

112

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

STW5098BBLR/LF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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