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TLV320AIC1103PBSG4

Texas Instruments

TLV320AIC1103PBSG4 by Texas Instruments

TLV320AIC1103PBSG4 by Texas Instruments is a 32-terminal audio codec with 15-bit linear coding and A/MU-LAW companding law. Operating at 3V, it has a max temperature of 85°C and is ideal for PCM codec applications in industrial settings. The package style is flatpack with thin profile, fine pitch, and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,980 parts In-Stock

1+ parts

-

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8,980

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Digiode

USA . 2,141 parts In-Stock

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2,141

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,587 parts In-Stock

1+ parts

$12.545

100+ parts

-

1k+ parts

$12.999

10k+ parts

-

1,587

$12.545

-

$12.999

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DigiPath Technology Company

USA . 90 parts In-Stock

1+ parts

$13.814

100+ parts

$12.709

1k+ parts

-

10k+ parts

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90

$13.814

$12.709

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ChromeModa Solutions

Germany . 5,848 parts In-Stock

1+ parts

$14.096

100+ parts

$11.559

1k+ parts

-

10k+ parts

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5,848

$14.096

$11.559

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IDEA Electronic Components Group

UK . 797 parts In-Stock

1+ parts

$14.096

100+ parts

$13.391

1k+ parts

$12.686

10k+ parts

-

797

$14.096

$13.391

$12.686

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AZTECH Wire

Italy . 324 parts In-Stock

1+ parts

$19.170

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324

$19.170

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One Stop Electronics

USA . 254 parts In-Stock

1+ parts

$375.000

100+ parts

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254

$375.000

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Ampacity Inc.

Singapore . 1,265 parts In-Stock

1+ parts

$715.000

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1,265

$715.000

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Semicontronic

India . 481 parts In-Stock

1+ parts

$903.000

100+ parts

$880.425

1k+ parts

$875.910

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481

$903.000

$880.425

$875.910

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Corphita

USA . 1,228 parts In-Stock

1+ parts

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1,228

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Corohmni

South Africa . 455 parts In-Stock

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455

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Overview

Experience superior audio quality with the TLV320AIC1103PBSG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch audio codecs that are perfect for a wide range of applications. Whether you're looking to enhance your sound system or improve communication devices, this product offers outstanding value and benefits. With its innovative technology and reliable performance, the TLV320AIC1103PBSG4 is a must-have for those seeking high-quality audio solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the audio codec, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes it easier to integrate this audio codec into circuit boards, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

The synchronous operation mode ensures precise timing and synchronization, which is crucial for audio processing applications.

Power Supplies (V): 3

Operating at a voltage of 3V allows for compatibility with standard power sources and efficient power consumption.

No. of Terminals: 32

Having 32 terminals provides flexibility in connectivity options and allows for more features and functionalities.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in a wide range of environmental conditions.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the audio codec can withstand some moisture exposure, making it suitable for various indoor and outdoor applications.

Technical Specifications

Audio Codecs TLV320AIC1103PBSG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

5 mm

Linear Coding:

15-BIT

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP32,.28SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Maximum Supply Current:

.007 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLV320AIC1103PBSG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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