Loading...

TCM29C13AJ

Texas Instruments

TCM29C13AJ by Texas Instruments

TCM29C13AJ by Texas Instruments is an Audio Codec with SYNCHRONOUS/ASYNCHRONOUS operation, A/MU-LAW companding law, and 20 terminals. It is used in PCM CODEC applications, operates at -5V to +5V power supplies, and has a package style of IN-LINE.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,624

-

-

-

-

Digiode

USA . 3,689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,689

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 356 parts In-Stock

1+ parts

$5.207

100+ parts

-

1k+ parts

-

10k+ parts

-

356

$5.207

-

-

-

Parana Technologies

USA . 440 parts In-Stock

1+ parts

$8.675

100+ parts

$805.590

1k+ parts

$7.807

10k+ parts

-

440

$8.675

$805.590

$7.807

-

DigiPath Technology Company

USA . 2,120 parts In-Stock

1+ parts

$9.552

100+ parts

-

1k+ parts

-

10k+ parts

-

2,120

$9.552

-

-

-

ChromeModa Solutions

Germany . 3,569 parts In-Stock

1+ parts

$9.747

100+ parts

$7.993

1k+ parts

-

10k+ parts

-

3,569

$9.747

$7.993

-

-

IDEA Electronic Components Group

UK . 2,232 parts In-Stock

1+ parts

$9.747

100+ parts

$9.260

1k+ parts

$8.772

10k+ parts

-

2,232

$9.747

$9.260

$8.772

-

One Stop Electronics

USA . 600 parts In-Stock

1+ parts

$687.000

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$687.000

-

-

-

Corphita

USA . 1,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,470

-

-

-

-

Overview

Elevate your audio experience with the TCM29C13AJ by Texas Instruments, a top-of-the-line PCM CODEC designed to deliver crystal-clear sound quality and unmatched performance. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this Audio Codec is built to last and exceed your expectations. Perfect for a wide range of applications, from telecommunications to consumer electronics, this compact and efficient device offers unparalleled value, benefits, and advantages to customers seeking premium audio solutions. Choose Texas Instruments for superior quality and reliability in every sound experience.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for the internal components, ensuring reliability in various operating conditions.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes allows for flexibility in different communication systems, making this product versatile.

Power Supplies (V): +-5

The dual power supplies of +-5 volts offer stable and balanced power distribution, contributing to the overall performance and efficiency of the audio codec.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this audio codec can function effectively in various environments without overheating or performance degradation.

Technology: CMOS

Utilizing CMOS technology enables low power consumption, high speed operation, and compatibility with a wide range of systems, making this audio codec a cost-effective and efficient choice.

Technical Specifications

Audio Codecs TCM29C13AJ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM29C13AJ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20