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TLV320AIC1110ZQER

Texas Instruments

TLV320AIC1110ZQER by Texas Instruments

TLV320AIC1110ZQER by Texas Instruments is an 80-terminal audio codec with 15-bit linear coding and companding law A/MU-LAW. It operates at temperatures from -40 to 85°C, suitable for industrial applications like PCM codecs in telecom ICs.

Median Price

$4.410

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,692 parts In-Stock

1+ parts

$4.410

100+ parts

$4.320

1k+ parts

$4.230

10k+ parts

-

6,692

$4.410

$4.320

$4.230

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 25 parts In-Stock

1+ parts

$11.400

100+ parts

$5.700

1k+ parts

-

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25

$11.400

$5.700

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Vyrian

USA . 3,459 parts In-Stock

1+ parts

-

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3,459

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Digiode

USA . 1,010 parts In-Stock

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1,010

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Microfarads

USA . 24 parts In-Stock

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24

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,043 parts In-Stock

1+ parts

$11.677

100+ parts

$1,084.368

1k+ parts

$10.509

10k+ parts

-

2,043

$11.677

$1,084.368

$10.509

-

DigiPath Technology Company

USA . 1,440 parts In-Stock

1+ parts

$12.858

100+ parts

$11.829

1k+ parts

-

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-

1,440

$12.858

$11.829

-

-

ChromeModa Solutions

Germany . 6,296 parts In-Stock

1+ parts

$13.120

100+ parts

$10.758

1k+ parts

-

10k+ parts

-

6,296

$13.120

$10.758

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-

IDEA Electronic Components Group

UK . 1,096 parts In-Stock

1+ parts

$13.120

100+ parts

$12.464

1k+ parts

$11.808

10k+ parts

-

1,096

$13.120

$12.464

$11.808

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AZTECH Wire

Italy . 329 parts In-Stock

1+ parts

$13.459

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329

$13.459

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Component Stockers USA

USA . 468 parts In-Stock

1+ parts

$99.990

100+ parts

-

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468

$99.990

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One Stop Electronics

USA . 335 parts In-Stock

1+ parts

$393.000

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335

$393.000

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A-Z Elektronik GmbH

Germany . 6,518 parts In-Stock

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6,518

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Kepictronics

USA . 4,808 parts In-Stock

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4,808

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Corphita

USA . 718 parts In-Stock

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718

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Microchip USA

USA . 270 parts In-Stock

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270

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Authorized Procurement Solutions

USA . 48 parts In-Stock

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48

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Overview

Experience high-quality audio like never before with the TLV320AIC1110ZQER by Texas Instruments, a leading manufacturer known for its innovative solutions. This audio codec is perfect for a wide range of applications in the audio industry. Offering exceptional value and benefits, this product provides customers with unparalleled sound performance and reliability. Elevate your audio experience with the TLV320AIC1110ZQER and enjoy crystal-clear sound quality every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the audio codec, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Output Code: TWOS COMPLEMENT

Twos complement encoding enables accurate representation of both positive and negative values, ensuring high precision in audio signal processing.

Package Shape: SQUARE

The square package shape facilitates efficient placement on the circuit board and ensures a compact design for space-saving benefits.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination of data flow within the audio codec, leading to improved performance and reliability.

Input Code: TWOS COMPLEMENT

Using twos complement for input code supports consistency with the output code, maintaining accuracy and reliability throughout the audio signal processing.

Power Supplies (V): 3

Operating at 3 volts provides optimal power efficiency while still delivering sufficient voltage for the audio codec to function effectively.

No. of Terminals: 80

Having 80 terminals allows for multiple connections and versatile integration options, enabling flexibility in the audio codec's use and configuration.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact form factor, making it ideal for space-constrained applications and enhancing ease of assembly on PCBs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the audio codec can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the audio codec remains operational in varying climates and temperatures, ensuring versatility and reliability.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity, corrosion resistance, and solderability for durable and reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and connection to the circuit board, enhancing efficiency and simplifying the assembly process.

Linear Coding: 15-BIT

Utilizing 15-bit linear coding allows for high-resolution audio processing and accurate representation of analog signals, ensuring superior audio quality.

Maximum Seated Height: 1 mm

With a low seated height, the audio codec can be accommodated in compact devices and applications without sacrificing performance or functionality.

Width: 5 mm

A width of 5mm offers a compact form factor for space-efficient integration into electronic systems, contributing to overall design flexibility and optimization.

Companding Law: A/MU-LAW

Utilizing A/mu-law companding law enables efficient compression and expansion of audio signals, ensuring optimal dynamic range and signal-to-noise ratio.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable solder reflow processes and maintains the integrity of the audio codec during assembly.

Peak Reflow Temperature °C: 260

Operating at a peak reflow temperature of 260°C ensures proper soldering and assembly of the audio codec, resulting in durable and robust connections.

Length: 5 mm

A length of 5mm contributes to the audio codec's compact design and allows for efficient placement on the PCB, optimizing space utilization in electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that the audio codec can operate reliably in harsh industrial environments, making it suitable for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems, ensuring efficient and reliable performance of the audio codec.

Terminal Form: BALL

Ball terminal form facilitates reliable connections and soldering during assembly, ensuring durability and longevity of the audio codec in various electronic applications.

Maximum Supply Current: 0.006 mA

With a low maximum supply current of 0.006 mA, the audio codec consumes minimal power while maintaining optimal performance, contributing to energy efficiency and extended battery life.

Telecom IC Type: PCM CODEC

Being a Pulse Code Modulation (PCM) codec, this audio codec ensures high-quality digital audio encoding and decoding for reliable communication and signal processing in telecommunications applications.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 volts provides consistent power input for the audio codec, ensuring stable performance and efficiency in various electronic systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for dense and compact layout design on the PCB, optimizing space utilization and enabling high-density integration in electronic devices.

Maximum Gain Tolerance: 1.2 dB

The maximum gain tolerance of 1.2 dB ensures precise and consistent gain levels in audio processing, resulting in high-fidelity sound output and superior audio quality.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the audio codec can withstand moderate exposure to moisture during storage and assembly, ensuring long-term reliability and performance.

Input Type: 'SINGLE-ENDED,DIFF'

Supporting both single-ended and differential input types offers versatility and compatibility with a wide range of audio sources, ensuring flexibility in audio signal acquisition and processing.

Filter: YES

The inclusion of a filter enhances the audio codec's signal processing capabilities, enabling noise reduction, signal enhancement, and improved audio quality for a superior listening experience.

Technical Specifications

Audio Codecs TLV320AIC1110ZQER attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1.2 dB

Input Code:

TWOS COMPLEMENT

Input Type:

"SINGLE-ENDED,DIFF"

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Linear Coding:

15-BIT

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

80

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Code:

TWOS COMPLEMENT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Codecs

Maximum Supply Current:

.006 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLV320AIC1110ZQER Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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