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5962-9086301MXA

Texas Instruments

5962-9086301MXA by Texas Instruments

Texas Instruments' 5962-9086301MXA is an Audio Codec with synchronous/asynchronous operation, CMOS technology, and PCM codec type. It comes in a chip carrier package with 28 terminals and operates in industrial temperature range. Ideal for telecom applications requiring filtering capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,795 parts In-Stock

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Digiode

USA . 2,559 parts In-Stock

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2,559

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Distributors (Availability)

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AZTECH Wire

Italy . 452 parts In-Stock

1+ parts

$7.512

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452

$7.512

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Parana Technologies

USA . 2,181 parts In-Stock

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$13.085

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$13.580

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2,181

$13.085

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$13.580

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ChromeModa Solutions

Germany . 1,458 parts In-Stock

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$14.702

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$12.056

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1,458

$14.702

$12.056

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IDEA Electronic Components Group

UK . 837 parts In-Stock

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$14.702

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$13.967

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$13.232

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837

$14.702

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$13.232

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Native Components

USA . 602 parts In-Stock

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$82.575

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$79.272

602

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$79.272

Northwest PG Solutions

USA . 1,767 parts In-Stock

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$90.832

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1,767

$90.832

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One Stop Electronics

USA . 1,294 parts In-Stock

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$943.000

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Corphita

USA . 4,562 parts In-Stock

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DigiPath Technology Company

USA . 572 parts In-Stock

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$13.255

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Overview

Enhance your audio experience with the 5962-9086301MXA by Texas Instruments. Crafted with precision using top-quality materials, this PCM CODEC offers seamless synchronous/asynchronous operation in industrial-grade temperatures. Perfect for a wide range of applications, from telecommunications to sound systems, this chip carrier package ensures optimal performance and reliability. Elevate your audio projects with the unmatched value and benefits of Texas Instruments technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body materials ensures durability and reliability in various operating conditions.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility and compatibility with different systems.

No. of Terminals: 28

Having 28 terminals allows for a higher level of connectivity and functionality in the product.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compactness and ease of integration in electronic circuits.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can perform reliably even in high-temperature environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this product suitable for a wide range of applications, including extreme cold environments.

Terminal Position: QUAD

The quad terminal position provides a balanced configuration for optimal signal transmission and reception.

Maximum Seated Height: 2.03 mm

The low seated height of 2.03 mm allows for space-efficient design and installation in compact devices.

Width: 11.43 mm

The width of 11.43 mm offers a good balance between compactness and ease of handling during assembly.

Length: 11.43 mm

The length of 11.43 mm provides a square form factor, making it easy to mount and integrate into various electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments where temperature fluctuations are common.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Telecom IC Type: PCM CODEC

Being a PCM CODEC type, this product is suitable for telecommunications applications requiring high-quality audio encoding and decoding capabilities.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and secure connections, ensuring stable performance in various applications.

Filter: YES

The inclusion of a filter enhances the audio quality by reducing unwanted noise and interference, making this product ideal for audio processing applications.

Technical Specifications

Audio Codecs 5962-9086301MXA attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

Length:

11.43 mm

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

5962-9086301MXA Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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