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5962-9086301M3A

Texas Instruments

5962-9086301M3A by Texas Instruments

Texas Instruments' 5962-9086301M3A is an Audio Codec with synchronous/asynchronous operation, CMOS technology, and PCM codec type. It comes in a chip carrier package with 28 terminals and operates in industrial temperature range. Ideal for telecom applications requiring filtering capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,164 parts In-Stock

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Digiode

USA . 2,396 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 747 parts In-Stock

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$7.400

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$7.400

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Parana Technologies

USA . 13 parts In-Stock

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$13.330

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$13.840

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DigiPath Technology Company

USA . 874 parts In-Stock

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$14.677

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874

$14.677

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ChromeModa Solutions

Germany . 4,835 parts In-Stock

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$14.977

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$12.281

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4,835

$14.977

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IDEA Electronic Components Group

UK . 1,958 parts In-Stock

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$14.977

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$14.228

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$13.479

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1,958

$14.977

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One Stop Electronics

USA . 383 parts In-Stock

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$356.000

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Corphita

USA . 4,375 parts In-Stock

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Northwest PG Solutions

USA . 2,160 parts In-Stock

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$4.692

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Native Components

USA . 686 parts In-Stock

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$4.644

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Overview

Enhance your audio experience with the 5962-9086301M3A by Texas Instruments, a top-quality PCM CODEC designed for industrial-grade applications. Texas Instruments is renowned for producing cutting-edge technology, and this chip carrier package embodies their commitment to excellence. Whether you're looking to improve sound quality in telecommunications or enhance audio processing in industrial settings, this synchronous/asynchronous operating mode codec offers unmatched value and benefits. Upgrade your audio systems today with Texas Instruments' superior technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability in various operating conditions, making it a high-quality choice for audio applications.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different communication systems, making it versatile for a wide range of audio encoding and decoding needs.

No. of Terminals: 28

With 28 terminals, this audio codec offers ample connectivity options for interfacing with other devices or components, allowing for seamless integration into audio systems.

Package Style: CHIP CARRIER

The chip carrier package style offers compactness and ease of mounting, making it suitable for space-constrained audio applications while ensuring convenient installation and maintenance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance even in demanding environmental conditions, making it ideal for industrial applications where heat may be a factor.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures functionality in cold environments, offering versatility for audio codec usage in a variety of temperature conditions.

Technology: CMOS

Utilizing CMOS technology enables low power consumption and high levels of integration, resulting in an efficient and reliable audio codec solution suitable for various battery-operated or portable devices.

Telecom IC Type: PCM CODEC

Being a PCM codec specifically designed for telecommunications applications, this product offers high-quality audio encoding and decoding capabilities, making it a preferred choice for voice communication systems.

Filter: YES

The presence of a filter enhances signal processing capabilities, allowing for improved audio quality and reduced noise in the output, making it an excellent choice for applications requiring clean and clear sound reproduction.

Technical Specifications

Audio Codecs 5962-9086301M3A attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

Length:

11.43 mm

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

5962-9086301M3A Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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