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TCM129C16ADWR

Texas Instruments

TCM129C16ADWR by Texas Instruments

TCM129C16ADWR by Texas Instruments is an Audio Codec with 16 terminals, operating from -40 to 85°C. It features companding law MU-LAW, synchronous/asynchronous mode, and a small outline package style. Ideal for telecom applications requiring PCM CODEC technology in industrial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,011 parts In-Stock

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6,011

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Digiode

USA . 4,558 parts In-Stock

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Lighthouse Electronics, Inc.

USA . 1,586 parts In-Stock

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1,586

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Distributors (Availability)

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Parana Technologies

USA . 968 parts In-Stock

1+ parts

$7.021

100+ parts

-

1k+ parts

$7.574

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968

$7.021

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$7.574

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DigiPath Technology Company

USA . 2,279 parts In-Stock

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$7.731

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2,279

$7.731

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ChromeModa Solutions

Germany . 2,220 parts In-Stock

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$7.889

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$6.469

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2,220

$7.889

$6.469

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IDEA Electronic Components Group

UK . 408 parts In-Stock

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$7.889

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$7.100

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408

$7.889

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$7.100

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AZTECH Wire

Italy . 453 parts In-Stock

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$11.441

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453

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One Stop Electronics

USA . 1,289 parts In-Stock

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$815.000

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$815.000

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Corphita

USA . 4,741 parts In-Stock

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Overview

Enhance your audio experience with the TCM129C16ADWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This audio codec is perfect for a wide range of applications, providing seamless synchronous/asynchronous operation in a compact package. With its companding law, small outline package style, and industrial temperature grade, this product offers exceptional value and benefits to customers seeking high-quality audio solutions. Upgrade your audio system with the TCM129C16ADWR and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the audio codec, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used in electronic components, making it compatible with standard mounting methods and layouts.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for both synchronous and asynchronous operation enables flexibility in connecting the audio codec to various systems and devices.

No. of Terminals: 16

Having 16 terminals provides a sufficient number of connection points for input and output signals, allowing for versatile integration into audio systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making the audio codec suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures stable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the audio codec to function reliably in cold environments without risk of damage.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal integrity, enhancing the overall performance of the audio codec.

Maximum Seated Height: 2.65 mm

Low seated height facilitates compact design of electronic devices using the audio codec, enabling slim and sleek product form factors.

Width: 7.5 mm

Narrow width dimension contributes to space-saving integration of the audio codec in electronic assemblies with limited board real estate.

Companding Law: MU-LAW

MU-LAW companding law ensures efficient compression and expansion of audio signals, maintaining high-quality sound reproduction in communication systems.

Length: 10.3 mm

Moderate length dimension allows for easy placement and routing of the audio codec within electronic devices, facilitating streamlined circuit layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification guarantees reliable operation of the audio codec in demanding industrial settings with extreme temperature fluctuations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and signal integrity of the audio codec.

Nominal Negative Supply Voltage: -5 V

Nominal negative supply voltage of -5 V allows for dual power supply configuration, enabling proper biasing and optimal performance of the audio codec.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure attachment of the audio codec to the circuit board, ensuring reliable electrical connections.

Maximum Supply Current: 13 mA

Low maximum supply current requirement minimizes power consumption and heat generation, leading to energy-efficient operation of the audio codec.

Telecom IC Type: PCM CODEC

PCM codec type is ideal for telecommunication applications, providing high-quality voice encoding and decoding for clear and reliable communication.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5 V offers compatibility with standard electronic systems, ensuring seamless integration of the audio codec in various applications.

Terminal Pitch: 1.27 mm

Compact terminal pitch allows for dense packing of terminals on the audio codec, enabling high-density mounting and efficient use of board space.

Filter: YES

Built-in filter enhances the audio quality by removing unwanted noise and interference from the signals, resulting in clear and crisp audio output.

Technical Specifications

Audio Codecs TCM129C16ADWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM129C16ADWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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