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TCM129C13DWR

Texas Instruments

TCM129C13DWR by Texas Instruments

TCM129C13DWR by Texas Instruments is an Audio Codec with a package style of Small Outline, operating at temperatures from -40 to 85°C. It features companding law A/MU-LAW, synchronous operation mode, and a nominal voltage of 5V. Ideal for telecom applications requiring PCM CODEC technology in industrial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,846 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,846

-

-

-

-

Digiode

USA . 3,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,585

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 747 parts In-Stock

1+ parts

$5.855

100+ parts

-

1k+ parts

-

10k+ parts

-

747

$5.855

-

-

-

Parana Technologies

USA . 626 parts In-Stock

1+ parts

$9.049

100+ parts

-

1k+ parts

$9.710

10k+ parts

-

626

$9.049

-

$9.710

-

DigiPath Technology Company

USA . 1,575 parts In-Stock

1+ parts

$9.964

100+ parts

$9.167

1k+ parts

-

10k+ parts

-

1,575

$9.964

$9.167

-

-

ChromeModa Solutions

Germany . 4,460 parts In-Stock

1+ parts

$10.167

100+ parts

$8.337

1k+ parts

-

10k+ parts

-

4,460

$10.167

$8.337

-

-

IDEA Electronic Components Group

UK . 420 parts In-Stock

1+ parts

$10.167

100+ parts

$9.659

1k+ parts

$9.150

10k+ parts

-

420

$10.167

$9.659

$9.150

-

One Stop Electronics

USA . 1,270 parts In-Stock

1+ parts

$238.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,270

$238.000

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-

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A-Z Elektronik GmbH

Germany . 16,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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16,805

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-

-

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Corphita

USA . 740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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740

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-

Overview

Experience superior audio quality with the TCM129C13DWR by Texas Instruments, a leading manufacturer known for its innovative solutions. As part of the Audio Codecs category, this product offers exceptional value and benefits for various applications. With a compact design and wide operating temperature range, customers can trust in the reliability and versatility of this PCM CODEC. Upgrade your audio systems with the TCM129C13DWR and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good protection and durability for the audio codec, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design in electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and synchronization for accurate audio processing.

Power Supplies (V): +-5

Supports a wide range of power supplies (+-5V), making it versatile and compatible with different systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the audio codec energy-efficient and reliable.

Telecom IC Type: PCM CODEC

Designed specifically for telecom applications, providing high-quality voice communication and data transmission.

Technical Specifications

Audio Codecs TCM129C13DWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM129C13DWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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