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TP13064BJ

Texas Instruments

TP13064BJ by Texas Instruments

TP13064BJ by Texas Instruments is an Audio Codec with a ceramic, glass-sealed package. It operates in synchronous/asynchronous mode at +-5V power supplies. Ideal for telecom applications, it features 20 terminals, mu-law companding law, and a filter for industrial-grade temperature ranges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,872

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-

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Digiode

USA . 4,332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,332

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 770 parts In-Stock

1+ parts

$9.049

100+ parts

-

1k+ parts

-

10k+ parts

-

770

$9.049

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-

-

Parana Technologies

USA . 2,176 parts In-Stock

1+ parts

$13.524

100+ parts

-

1k+ parts

$14.028

10k+ parts

-

2,176

$13.524

-

$14.028

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ChromeModa Solutions

Germany . 3,776 parts In-Stock

1+ parts

$15.196

100+ parts

$12.461

1k+ parts

-

10k+ parts

-

3,776

$15.196

$12.461

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IDEA Electronic Components Group

UK . 1,404 parts In-Stock

1+ parts

$15.196

100+ parts

$14.436

1k+ parts

$13.676

10k+ parts

-

1,404

$15.196

$14.436

$13.676

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One Stop Electronics

USA . 614 parts In-Stock

1+ parts

$507.000

100+ parts

-

1k+ parts

-

10k+ parts

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614

$507.000

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Corphita

USA . 4,858 parts In-Stock

1+ parts

-

100+ parts

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4,858

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DigiPath Technology Company

USA . 2,226 parts In-Stock

1+ parts

-

100+ parts

$13.701

1k+ parts

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10k+ parts

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2,226

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$13.701

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Overview

Enhance your audio experience with the TP13064BJ by Texas Instruments, a high-quality PCM CODEC designed for various telecom applications. Manufactured with precision and expertise, this audio codec boasts a compact design, reliable performance, and wide temperature range suitability. Whether for professional communication systems or consumer electronics, this versatile product offers outstanding value, benefits, and advantages to meet your audio processing needs. Elevate your audio solutions with the TP13064BJ today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and protection, making this product suitable for long-term use in various environments.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes offers flexibility in different applications, allowing for compatibility with diverse systems and protocols.

Power Supplies (V): +-5

The wide range of power supply voltage tolerance of +-5V provides stability and reliability, ensuring consistent performance under varying conditions.

No. of Terminals: 20

With 20 terminals, this product offers versatile connectivity options for integration in complex audio systems, allowing for extensive functionality and control.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures resilience and functionality in demanding environments where heat may be a factor.

Technology: CMOS

The use of CMOS technology ensures low power consumption and efficient operation, making this product energy-efficient and cost-effective.

Technical Specifications

Audio Codecs TP13064BJ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

11 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TP13064BJ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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