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TP13054ADW

Texas Instruments

TP13054ADW by Texas Instruments

TP13054ADW by Texas Instruments is an Audio Codec with +-5V power supplies, 16 terminals, and companding law MU-LAW. It operates in industrial temperature range and is ideal for PCM codec applications in telecom ICs. The package style is small outline with gull wing terminal form, suitable for surface mount assembly.

Median Price

$2.255

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 214 parts In-Stock

1+ parts

-

100+ parts

$1.950

1k+ parts

$1.740

10k+ parts

$1.640

214

-

$1.950

$1.740

$1.640

DigiKey

USA . 214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.560

10k+ parts

-

214

-

-

$2.560

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,377 parts In-Stock

1+ parts

$2.062

100+ parts

-

1k+ parts

-

10k+ parts

-

1,377

$2.062

-

-

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Vyrian

USA . 9,736 parts In-Stock

1+ parts

-

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-

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9,736

-

-

-

-

DigiKey Marketplace

USA . 214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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214

-

-

-

-

LWI Electronics Inc

India . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

10

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

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4

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,198 parts In-Stock

1+ parts

$1.953

100+ parts

-

1k+ parts

-

10k+ parts

-

3,198

$1.953

-

-

-

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$10.131

100+ parts

$9.219

1k+ parts

$8.307

10k+ parts

-

70

$10.131

$9.219

$8.307

-

Parana Technologies

USA . 809 parts In-Stock

1+ parts

$14.665

100+ parts

$1,361.824

1k+ parts

$13.198

10k+ parts

-

809

$14.665

$1,361.824

$13.198

-

DigiPath Technology Company

USA . 317 parts In-Stock

1+ parts

$16.147

100+ parts

-

1k+ parts

-

10k+ parts

-

317

$16.147

-

-

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ChromeModa Solutions

Germany . 1,246 parts In-Stock

1+ parts

$16.477

100+ parts

$13.511

1k+ parts

-

10k+ parts

-

1,246

$16.477

$13.511

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-

IDEA Electronic Components Group

UK . 234 parts In-Stock

1+ parts

$16.477

100+ parts

$15.653

1k+ parts

$14.829

10k+ parts

-

234

$16.477

$15.653

$14.829

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A-Z Elektronik GmbH

Germany . 4,841 parts In-Stock

1+ parts

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4,841

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Microchip USA

USA . 196 parts In-Stock

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196

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Kepictronics

USA . 68 parts In-Stock

1+ parts

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68

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Overview

Enhance your audio experience with the TP13054ADW by Texas Instruments. As a leader in audio codecs, Texas Instruments delivers top-quality products that exceed industry standards. Whether you're working on telecommunications, audio recording, or any other application requiring PCM codec technology, this compact and versatile device is the perfect solution. With its reliable performance, ease of use, and wide operating temperature range, the TP13054ADW ensures seamless integration into your project. Upgrade your audio system today and discover the exceptional value and benefits this product brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and lightweight, making this product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different application scenarios.

Power Supplies (V): +-5

The dual power supply option of +-5V ensures stable and reliable performance.

No. of Terminals: 16

Having 16 terminals allows for the connection of multiple components for improved functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the product to function in various temperature ranges.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel, palladium, and gold finish on the terminals ensures good conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board layout and design.

Width: 7.5 mm

The compact width of 7.5mm saves space in tight electronic assemblies.

Maximum Supply Current: 10 mA

Low maximum supply current helps in conserving power consumption.

Technical Specifications

Audio Codecs TP13054ADW attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TP13054ADW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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