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TP13054BFNR

Texas Instruments

TP13054BFNR by Texas Instruments

TP13054BFNR by Texas Instruments is an Audio Codec with 20 terminals in a square chip carrier package. Operating at -40 to 85°C, it supports synchronous/asynchronous modes and companding law μ-law. Ideal for telecom applications, this PCM CODEC features a nominal voltage of 5V and max supply current of 10mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,533

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-

-

-

Digiode

USA . 4,363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,363

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 510 parts In-Stock

1+ parts

$11.503

100+ parts

-

1k+ parts

$11.916

10k+ parts

-

510

$11.503

-

$11.916

-

DigiPath Technology Company

USA . 388 parts In-Stock

1+ parts

$12.666

100+ parts

-

1k+ parts

-

10k+ parts

-

388

$12.666

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-

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IDEA Electronic Components Group

UK . 2,234 parts In-Stock

1+ parts

$12.925

100+ parts

$12.279

1k+ parts

$11.632

10k+ parts

-

2,234

$12.925

$12.279

$11.632

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ChromeModa Solutions

Germany . 1,700 parts In-Stock

1+ parts

$12.925

100+ parts

$10.598

1k+ parts

-

10k+ parts

-

1,700

$12.925

$10.598

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-

AZTECH Wire

Italy . 226 parts In-Stock

1+ parts

$16.106

100+ parts

-

1k+ parts

-

10k+ parts

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226

$16.106

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-

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One Stop Electronics

USA . 376 parts In-Stock

1+ parts

$334.000

100+ parts

-

1k+ parts

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10k+ parts

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376

$334.000

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-

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Corphita

USA . 547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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547

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Overview

Experience the superior quality and reliability of Texas Instruments with the TP13054BFNR Audio Codec. This versatile chip carrier package offers synchronous/asynchronous operation, mu-law companding law, and a wide temperature range for industrial applications. Whether you're designing telecommunications equipment or audio processing systems, this PCM codec provides exceptional performance and efficiency. Trust in Texas Instruments to deliver cutting-edge technology and unmatched value to meet your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

Allows for easy and compact PCB assembly, saving space in the overall product design.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Provides flexibility in the operation mode, catering to different system requirements.

No. of Terminals: 20

Sufficient number of terminals for connecting to various components in the system, ensuring seamless integration.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial applications.

Nominal Negative Supply Voltage: -5 V

Supports a wide range of supply voltages, offering compatibility with different power sources.

Telecom IC Type: PCM CODEC

Specifically designed for telecom applications, ensuring high-quality audio encoding and decoding.

Technical Specifications

Audio Codecs TP13054BFNR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

TP13054BFNR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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