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TP13067BFN

Texas Instruments

TP13067BFN by Texas Instruments

TP13067BFN by Texas Instruments is an Audio Codec with 20 terminals in a square chip carrier package. Operating at -40 to 85°C, it supports A-Law companding law and has a nominal voltage of 5V. Ideal for telecom applications requiring PCM encoding/decoding with synchronous/asynchronous operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,174

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-

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Digiode

USA . 2,194 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,194

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 440 parts In-Stock

1+ parts

$9.685

100+ parts

-

1k+ parts

$10.267

10k+ parts

-

440

$9.685

-

$10.267

-

DigiPath Technology Company

USA . 1,595 parts In-Stock

1+ parts

$10.664

100+ parts

$9.811

1k+ parts

-

10k+ parts

-

1,595

$10.664

$9.811

-

-

ChromeModa Solutions

Germany . 408 parts In-Stock

1+ parts

$10.882

100+ parts

$8.923

1k+ parts

-

10k+ parts

-

408

$10.882

$8.923

-

-

IDEA Electronic Components Group

UK . 316 parts In-Stock

1+ parts

$10.882

100+ parts

$10.338

1k+ parts

$9.794

10k+ parts

-

316

$10.882

$10.338

$9.794

-

AZTECH Wire

Italy . 686 parts In-Stock

1+ parts

$16.135

100+ parts

-

1k+ parts

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10k+ parts

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686

$16.135

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One Stop Electronics

USA . 1,212 parts In-Stock

1+ parts

$838.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,212

$838.000

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Corphita

USA . 1,921 parts In-Stock

1+ parts

-

100+ parts

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1,921

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Overview

Enhance your audio systems with the TP13067BFN from Texas Instruments, a leading manufacturer known for delivering top-quality products. This Audio Codec offers unparalleled sound clarity and precision, making it ideal for a wide range of applications. With its advanced features and reliable performance, this chip carrier package ensures seamless operation in both synchronous and asynchronous modes. Upgrade your audio experience with the TP13067BFN and enjoy the value, benefits, and advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable audio devices.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different audio processing applications.

Companding Law: A-LAW

The A-Law companding law ensures efficient compression and expansion of audio signals, resulting in high-quality sound output.

Telecom IC Type: PCM CODEC

Being a PCM codec telecom IC type, this product is designed specifically for telecommunication applications, ensuring reliable and high-performance audio encoding and decoding.

Filter: YES

The presence of a filter helps in reducing noise and improving the overall audio quality, making this product suitable for clear and crisp audio transmissions.

Technical Specifications

Audio Codecs TP13067BFN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

11 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

TP13067BFN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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