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TP3064BFN

Texas Instruments

TP3064BFN by Texas Instruments

TP3064BFN by Texas Instruments is a PCM CODEC with MU-LAW companding law. It operates in synchronous/asynchronous mode, has 20 terminals, and supports filter. This audio codec is ideal for telecom applications due to its -5V negative supply voltage and 5V nominal voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,396 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,396

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Digiode

USA . 1,916 parts In-Stock

1+ parts

-

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1,916

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,339 parts In-Stock

1+ parts

$13.460

100+ parts

$1,249.999

1k+ parts

$12.114

10k+ parts

-

1,339

$13.460

$1,249.999

$12.114

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AZTECH Wire

Italy . 613 parts In-Stock

1+ parts

$14.384

100+ parts

-

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613

$14.384

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DigiPath Technology Company

USA . 1,179 parts In-Stock

1+ parts

$14.822

100+ parts

-

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10k+ parts

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1,179

$14.822

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IDEA Electronic Components Group

UK . 1,645 parts In-Stock

1+ parts

$15.124

100+ parts

$14.368

1k+ parts

$13.612

10k+ parts

-

1,645

$15.124

$14.368

$13.612

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ChromeModa Solutions

Germany . 34 parts In-Stock

1+ parts

$15.124

100+ parts

$12.402

1k+ parts

-

10k+ parts

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34

$15.124

$12.402

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Semicontronic

India . 1,203 parts In-Stock

1+ parts

$701.000

100+ parts

$683.475

1k+ parts

$679.970

10k+ parts

-

1,203

$701.000

$683.475

$679.970

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One Stop Electronics

USA . 179 parts In-Stock

1+ parts

$963.000

100+ parts

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179

$963.000

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Corphita

USA . 2,809 parts In-Stock

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2,809

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Corohmni

South Africa . 387 parts In-Stock

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387

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Overview

Upgrade your audio systems with the TP3064BFN by Texas Instruments, a top-tier manufacturer known for its quality and reliability. As a leading player in the Audio Codecs category, this chip carrier package offers synchronous/asynchronous operation with 20 terminals for seamless integration. Perfect for telecom applications requiring PCM CODECs, this product ensures crystal-clear sound with companding law MU-LAW. With a wide operating temperature range and low supply current, the TP3064BFN brings exceptional value and performance to your projects. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the audio codec, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into electronic circuits, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for both synchronous and asynchronous operating modes offers flexibility in various system configurations and compatibility with different devices.

No. of Terminals: 20

Having 20 terminals provides multiple connection points for seamless integration and communication with other components in the system.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this audio codec can withstand extended use under normal operating conditions without overheating.

Telecom IC Type: PCM CODEC

Being a PCM codec, this product is designed specifically for telecommunications applications, ensuring high-quality voice transmission and reception.

Technical Specifications

Audio Codecs TP3064BFN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

TP3064BFN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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