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TLC32040MFK

Texas Instruments

TLC32040MFK by Texas Instruments

TLC32040MFK by Texas Instruments is a PCM CODEC with 28 terminals, operating from -55 to 125 °C. It features synchronous/asynchronous mode, CMOS technology, and military-grade temperature range. Ideal for telecom applications, this chip carrier package codec has a ceramic-metal-sealed co-fired body and supports filtering.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,719 parts In-Stock

1+ parts

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3,719

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Vyrian

USA . 2,630 parts In-Stock

1+ parts

-

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2,630

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,228 parts In-Stock

1+ parts

$14.578

100+ parts

-

1k+ parts

$15.016

10k+ parts

-

1,228

$14.578

-

$15.016

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AZTECH Wire

Italy . 740 parts In-Stock

1+ parts

$15.386

100+ parts

-

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740

$15.386

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IDEA Electronic Components Group

UK . 892 parts In-Stock

1+ parts

$16.380

100+ parts

$15.561

1k+ parts

$14.742

10k+ parts

-

892

$16.380

$15.561

$14.742

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ChromeModa Solutions

Germany . 514 parts In-Stock

1+ parts

$16.380

100+ parts

$13.432

1k+ parts

-

10k+ parts

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514

$16.380

$13.432

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One Stop Electronics

USA . 665 parts In-Stock

1+ parts

$695.000

100+ parts

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665

$695.000

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Corphita

USA . 4,588 parts In-Stock

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4,588

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DigiPath Technology Company

USA . 2,207 parts In-Stock

1+ parts

-

100+ parts

$14.768

1k+ parts

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2,207

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$14.768

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Overview

Experience exceptional audio quality and reliability with the TLC32040MFK by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products like this audio codec that offers seamless integration and high performance in a compact square package. Perfect for a variety of applications in the telecommunications sector, this chip carrier style codec operates in synchronous/asynchronous mode, providing customers with unmatched value, benefits, and advantages. Upgrade your audio systems with the TLC32040MFK and enjoy superior sound quality like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal conductivity and insulation, making it suitable for high temperature environments.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB assembly, saving space and improving manufacturing efficiency.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Provides flexibility in operation depending on the application requirements, allowing for versatile use.

No. of Terminals: 28

Sufficient number of terminals for connecting to other components and circuits, enabling effective signal processing.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for demanding industrial and military applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with various systems and easy integration into existing setups.

Telecom IC Type: PCM CODEC

Specifically designed for telecommunications applications, ensuring high-quality audio encoding and decoding.

Technical Specifications

Audio Codecs TLC32040MFK attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Current:

40 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

TLC32040MFK Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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