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TLC32044CFN

Texas Instruments

TLC32044CFN by Texas Instruments

TLC32044CFN by Texas Instruments is a 14-bit PCM CODEC with +-5V supplies, operating from 0 to 70°C. It features synchronous/asynchronous modes and a filter in a square chip carrier package. Ideal for telecom applications requiring high-quality audio processing in commercial temperature environments.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 7,004 parts In-Stock

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Digiode

USA . 2,051 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 13 parts In-Stock

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Beltway Electronics Company

USA . 1 parts In-Stock

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Prism Electronics

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Euro-Tech

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AZTECH Wire

Italy . 680 parts In-Stock

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$4.881

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Parana Technologies

USA . 16 parts In-Stock

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$11.299

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$11.728

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DigiPath Technology Company

USA . 687 parts In-Stock

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$12.441

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ChromeModa Solutions

Germany . 1,767 parts In-Stock

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$12.695

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$10.410

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IDEA Electronic Components Group

UK . 1,629 parts In-Stock

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$12.060

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$11.426

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One Stop Electronics

USA . 1,530 parts In-Stock

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Ampacity Inc.

Singapore . 659 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Assy Fe

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Corphita

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Kepictronics

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Perfect Parts

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A-Plus Industry Inc.

USA . 2 parts In-Stock

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Overview

Delve into the world of high-quality audio with the TLC32044CFN by Texas Instruments, a leading manufacturer known for excellence in engineering. This Audio Codec offers unparalleled value and benefits for a wide range of applications. Whether you are looking to enhance sound quality in your latest project or improve communication in your telecom system, this versatile chip delivers superior performance and reliability. Trust Texas Instruments for cutting-edge technology that brings your audio experience to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

This feature allows for easy installation and saves space on the circuit board.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The flexibility to operate in both synchronous and asynchronous modes allows for compatibility with different systems and applications.

Power Supplies (V): +-5

The dual power supply option ensures stable and reliable performance.

No. of Terminals: 28

More terminals provide greater connectivity options and versatility in the setup.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand extended usage without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Audio Codecs TLC32044CFN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

Linear Coding:

14-BIT

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Codecs

Maximum Supply Current:

35 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.5062 mm

Trade Compliance

TLC32044CFN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-606-9742, 5962016069742

NIIN

016069742

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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