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PCD5032GP-T

NXP Semiconductors

PCD5032GP-T by NXP Semiconductors

ADPCM CODEC; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,303 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,303

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-

-

-

Anansix

USA . 1,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,485

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-

-

-

Digiode

USA . 948 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

948

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 861 parts In-Stock

1+ parts

$93.000

100+ parts

-

1k+ parts

-

10k+ parts

-

861

$93.000

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-

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UNI Independent Distributors

Spain . 6,897 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,897

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Corphita

USA . 3,821 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,821

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Technical Specifications

Audio Codecs PCD5032GP-T attributes and parameters. Explore more Audio Codecs devices from NXP Semiconductors

Specs

Filter:

YES

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

14 mm

No. of Functions:

1

No. of Terminals:

44

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.6 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

PCD5032GP-T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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Authentic purchasing experiences

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