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TLC32040IFNR

Texas Instruments

TLC32040IFNR by Texas Instruments

TLC32040IFNR by Texas Instruments is an Audio Codec with 28 terminals, operating from -40 to 85°C. It features synchronous/asynchronous mode, -5V negative supply voltage, and 5V nominal voltage. Ideal for PCM codec applications in telecom equipment due to its compact chip carrier package and filter capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,732 parts In-Stock

1+ parts

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4,732

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Digiode

USA . 4,709 parts In-Stock

1+ parts

-

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4,709

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 628 parts In-Stock

1+ parts

$12.107

100+ parts

-

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628

$12.107

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Parana Technologies

USA . 1,968 parts In-Stock

1+ parts

$12.295

100+ parts

-

1k+ parts

$12.726

10k+ parts

-

1,968

$12.295

-

$12.726

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DigiPath Technology Company

USA . 310 parts In-Stock

1+ parts

$13.539

100+ parts

$12.456

1k+ parts

-

10k+ parts

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310

$13.539

$12.456

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ChromeModa Solutions

Germany . 2,718 parts In-Stock

1+ parts

$13.815

100+ parts

$11.328

1k+ parts

-

10k+ parts

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2,718

$13.815

$11.328

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IDEA Electronic Components Group

UK . 1,517 parts In-Stock

1+ parts

$13.815

100+ parts

$13.124

1k+ parts

$12.434

10k+ parts

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1,517

$13.815

$13.124

$12.434

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One Stop Electronics

USA . 1,167 parts In-Stock

1+ parts

$819.000

100+ parts

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1,167

$819.000

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Corphita

USA . 1,404 parts In-Stock

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1,404

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Overview

Unlock the power of crystal-clear audio with the TLC32040IFNR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. Ideal for applications in telecommunications and audio equipment, this PCM CODEC offers unmatched value and benefits to customers. Experience seamless operation in both synchronous and asynchronous modes, along with a wide temperature range for industrial-grade performance. Upgrade your audio experience with the TLC32040IFNR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in reducing the overall weight of the product, making it more portable and easy to handle.

Surface Mount: YES

Being surface mountable, this product can be easily integrated onto circuit boards, saving space and improving overall design aesthetics.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different types of audio processing applications.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and enhances the versatility of the product in various audio systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions without compromising performance.

Nominal Supply Voltage: 5 V

A stable nominal supply voltage of 5V ensures consistent and reliable operation of the product, enabling smooth audio processing.

Filter: YES

The presence of a filter helps in enhancing the audio quality by reducing noise and distortion during signal processing, resulting in clear and crisp sound output.

Technical Specifications

Audio Codecs TLC32040IFNR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

40 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

TLC32040IFNR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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