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TCM37C15DW

Texas Instruments

TCM37C15DW by Texas Instruments

TCM37C15DW by Texas Instruments is a PCM CODEC with A-LAW companding law. It operates synchronously at +-5V, with 20 terminals in a small outline package suitable for telecom applications. Temperature range of 0-70°C and CMOS technology make it ideal for commercial use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,048 parts In-Stock

1+ parts

-

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6,048

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Digiode

USA . 4,564 parts In-Stock

1+ parts

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4,564

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 412 parts In-Stock

1+ parts

$6.994

100+ parts

-

1k+ parts

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412

$6.994

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Parana Technologies

USA . 576 parts In-Stock

1+ parts

$13.808

100+ parts

-

1k+ parts

$14.295

10k+ parts

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576

$13.808

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$14.295

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ChromeModa Solutions

Germany . 6,385 parts In-Stock

1+ parts

$15.515

100+ parts

$12.722

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-

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6,385

$15.515

$12.722

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IDEA Electronic Components Group

UK . 2,167 parts In-Stock

1+ parts

$15.515

100+ parts

$14.739

1k+ parts

$13.964

10k+ parts

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2,167

$15.515

$14.739

$13.964

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One Stop Electronics

USA . 1,370 parts In-Stock

1+ parts

$441.000

100+ parts

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1,370

$441.000

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Corphita

USA . 3,610 parts In-Stock

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3,610

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DigiPath Technology Company

USA . 1,922 parts In-Stock

1+ parts

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$13.988

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1,922

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$13.988

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Overview

Experience high-quality audio performance with the TCM37C15DW by Texas Instruments, a leading manufacturer known for its innovative technology and reliability. As part of the Audio Codecs category, this product offers seamless integration and superior sound quality in various applications. From telecommunications to audio recording, the TCM37C15DW provides value and benefits that exceed expectations. Upgrade your audio experience with this advanced solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable audio codec applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on circuit boards, saving time and space.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination, leading to accurate audio encoding and decoding.

Power Supplies (V): +-5

Wide power supply range of +-5V enables flexibility in various audio signal processing applications.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and interfaces, expanding the functionality of the audio codec chip.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C ensures reliability and performance under varying environmental conditions.

Companding Law: A-LAW

The A-law companding law provides optimal signal compression and expansion for high-quality audio transmission.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the audio codec efficient and reliable.

Filter: YES

Presence of a filter ensures clean and clear audio signal processing, improving overall audio quality.

Technical Specifications

Audio Codecs TCM37C15DW attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.2 dB

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM37C15DW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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