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TCM129C14DW-00

Texas Instruments

TCM129C14DW-00 by Texas Instruments

Texas Instruments TCM129C14DW-00 is an Audio Codec with 24 terminals, operating from -40 to 85°C. It features A/MU-LAW companding law, suitable for PCM CODEC telecom applications. The small outline package measures 15.4mm x 7.5mm x 2.65mm and has a gull wing terminal form for surface mounting in industrial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,982 parts In-Stock

1+ parts

-

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4,982

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Digiode

USA . 3,397 parts In-Stock

1+ parts

-

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3,397

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 744 parts In-Stock

1+ parts

$8.468

100+ parts

$786.415

1k+ parts

$7.622

10k+ parts

-

744

$8.468

$786.415

$7.622

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DigiPath Technology Company

USA . 1,377 parts In-Stock

1+ parts

$9.325

100+ parts

-

1k+ parts

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10k+ parts

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1,377

$9.325

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ChromeModa Solutions

Germany . 4,333 parts In-Stock

1+ parts

$9.515

100+ parts

$7.802

1k+ parts

-

10k+ parts

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4,333

$9.515

$7.802

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IDEA Electronic Components Group

UK . 2,033 parts In-Stock

1+ parts

$9.515

100+ parts

$9.039

1k+ parts

$8.564

10k+ parts

-

2,033

$9.515

$9.039

$8.564

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AZTECH Wire

Italy . 387 parts In-Stock

1+ parts

$17.241

100+ parts

-

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387

$17.241

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One Stop Electronics

USA . 475 parts In-Stock

1+ parts

$176.000

100+ parts

-

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475

$176.000

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Ampacity Inc.

Singapore . 1,573 parts In-Stock

1+ parts

$507.000

100+ parts

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1,573

$507.000

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Semicontronic

India . 857 parts In-Stock

1+ parts

$653.000

100+ parts

$636.675

1k+ parts

$633.410

10k+ parts

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857

$653.000

$636.675

$633.410

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Corphita

USA . 3,497 parts In-Stock

1+ parts

-

100+ parts

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3,497

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Corohmni

South Africa . 189 parts In-Stock

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189

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Overview

Elevate your audio experience with the TCM129C14DW-00 by Texas Instruments. Crafted with precision and expertise, this audio codec delivers superior sound quality and reliability. Perfect for a wide range of applications, this product offers unparalleled value and benefits to customers. Whether you're looking to enhance your audio systems or improve telecommunications devices, the TCM129C14DW-00 provides unmatched performance and efficiency. Trust in Texas Instruments to bring innovation and excellence to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and improving manufacturing efficiency.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility in timing and integration with other components.

Companding Law: A/MU-LAW

A/MU-Law companding law ensures high-quality audio compression and expansion, suitable for telecommunications applications.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent performance and compatibility with common power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for reliable operation in various environments.

Technical Specifications

Audio Codecs TCM129C14DW-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

24

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM129C14DW-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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