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PCM3501EG4

Texas Instruments

PCM3501EG4 by Texas Instruments

PCM3501EG4 by Texas Instruments is a 24-terminal audio codec with 16-bit linear coding. Operating at 3.3V, it offers synchronous/asynchronous modes and binary/twos comp input/output codes. Ideal for telecom applications, this small outline package has a max temperature of 85°C and terminal pitch of 0.65mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,558 parts In-Stock

1+ parts

-

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6,558

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Digiode

USA . 4,768 parts In-Stock

1+ parts

-

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4,768

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 939 parts In-Stock

1+ parts

$13.614

100+ parts

-

1k+ parts

$14.114

10k+ parts

-

939

$13.614

-

$14.114

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ChromeModa Solutions

Germany . 4,589 parts In-Stock

1+ parts

$15.297

100+ parts

$12.544

1k+ parts

-

10k+ parts

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4,589

$15.297

$12.544

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IDEA Electronic Components Group

UK . 104 parts In-Stock

1+ parts

$15.297

100+ parts

$14.532

1k+ parts

$13.767

10k+ parts

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104

$15.297

$14.532

$13.767

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AZTECH Wire

Italy . 637 parts In-Stock

1+ parts

$17.438

100+ parts

-

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637

$17.438

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One Stop Electronics

USA . 670 parts In-Stock

1+ parts

$201.000

100+ parts

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670

$201.000

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Corphita

USA . 4,228 parts In-Stock

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4,228

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DigiPath Technology Company

USA . 433 parts In-Stock

1+ parts

-

100+ parts

$13.792

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433

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$13.792

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Overview

Experience crystal clear audio quality like never before with the PCM3501EG4 by Texas Instruments. As a leading manufacturer in audio codecs, Texas Instruments delivers top-notch performance and reliability. Perfect for a wide range of applications, this product offers unmatched value and benefits to customers looking for superior sound processing. Upgrade your audio experience today with the PCM3501EG4 and enjoy high-quality audio in a compact and efficient package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to external factors, making the product long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto circuit boards, reducing assembly time and cost.

Output Code: BINARY/TWOS COMP

Support for both binary and twos complement output code enables flexibility in data representation, compatible with various systems.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Ability to operate in both synchronous and asynchronous modes allows for compatibility with different communication protocols.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, ensuring compatibility with common power supply systems.

No. of Terminals: 24

Sufficient number of terminals for connectivity and integration into complex circuitry.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of up to 85°C allows for reliable performance in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance efficiency.

Technical Specifications

Audio Codecs PCM3501EG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Maximum Analog Input:

3.6 V

Filter:

YES

Input Code:

BINARY/TWOS COMP

Input Type:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Linear Coding:

16-BIT

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output (V):

VOLTAGE

Output Code:

BINARY/TWOS COMP

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Codecs

Maximum Supply Current:

12 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

PCM3501EG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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