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TCM29C16N-00

Texas Instruments

TCM29C16N-00 by Texas Instruments

Texas Instruments TCM29C16N-00 is a PCM CODEC with MU-LAW companding law. It operates synchronously at temperatures from 0 to 70°C, consuming a max of 9mA at -5V and 5V nominal voltages. This Audio Codec in PLASTIC/EPOXY package is ideal for telecom applications due to its compact IN-LINE style and filter feature.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,666 parts In-Stock

1+ parts

-

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8,666

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Digiode

USA . 1,762 parts In-Stock

1+ parts

-

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1,762

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,073 parts In-Stock

1+ parts

$7.615

100+ parts

-

1k+ parts

$8.132

10k+ parts

-

1,073

$7.615

-

$8.132

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DigiPath Technology Company

USA . 1,066 parts In-Stock

1+ parts

$8.385

100+ parts

-

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-

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1,066

$8.385

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IDEA Electronic Components Group

UK . 1,939 parts In-Stock

1+ parts

$8.556

100+ parts

$8.128

1k+ parts

$7.700

10k+ parts

-

1,939

$8.556

$8.128

$7.700

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ChromeModa Solutions

Germany . 70 parts In-Stock

1+ parts

$8.556

100+ parts

$7.016

1k+ parts

-

10k+ parts

-

70

$8.556

$7.016

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AZTECH Wire

Italy . 679 parts In-Stock

1+ parts

$17.369

100+ parts

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679

$17.369

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Ampacity Inc.

Singapore . 242 parts In-Stock

1+ parts

$356.000

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242

$356.000

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Semicontronic

India . 1,607 parts In-Stock

1+ parts

$544.000

100+ parts

$530.400

1k+ parts

$527.680

10k+ parts

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1,607

$544.000

$530.400

$527.680

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One Stop Electronics

USA . 1,624 parts In-Stock

1+ parts

$846.000

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1,624

$846.000

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Corphita

USA . 1,579 parts In-Stock

1+ parts

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1,579

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Corohmni

South Africa . 164 parts In-Stock

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164

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Overview

Enhance your audio experience with the TCM29C16N-00 by Texas Instruments, a top-of-the-line Audio Codec designed to deliver unparalleled sound quality and reliability. With Texas Instruments' renowned reputation for excellence, you can trust that this product meets the highest standards in the industry. Ideal for a wide range of applications, this PCM Codec offers superior performance and functionality. Elevate your audio projects with the TCM29C16N-00 and enjoy the benefits of high-quality sound processing and seamless integration. Upgrade your audio solutions today with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring a long lifespan for the codec.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for precise timing and data transfer, ensuring accurate audio encoding and decoding.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this codec can function reliably in various environmental conditions without overheating.

Nominal Supply Voltage: 5 V

The 5V supply voltage provides stable power to the codec, allowing for consistent performance and audio quality.

Filter: YES

The inclusion of a filter helps in reducing noise and interference, resulting in clear and high-quality audio output.

Technical Specifications

Audio Codecs TCM29C16N-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM29C16N-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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