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TCM2910AJ-00

Texas Instruments

TCM2910AJ-00 by Texas Instruments

TCM2910AJ-00 by Texas Instruments is an Audio Codec with 24 terminals, operating in asynchronous mode. It features a companding law of MU-LAW and operates at temperatures b/w 0 to 70°C. This PCM CODEC is commonly used in telecom applications due to its filter feature and -5V to +5V supply voltage range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,652 parts In-Stock

1+ parts

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9,652

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Digiode

USA . 276 parts In-Stock

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276

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 464 parts In-Stock

1+ parts

$7.710

100+ parts

$715.997

1k+ parts

$6.939

10k+ parts

-

464

$7.710

$715.997

$6.939

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DigiPath Technology Company

USA . 169 parts In-Stock

1+ parts

$8.490

100+ parts

-

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169

$8.490

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ChromeModa Solutions

Germany . 3,550 parts In-Stock

1+ parts

$8.663

100+ parts

$7.104

1k+ parts

-

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3,550

$8.663

$7.104

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IDEA Electronic Components Group

UK . 31 parts In-Stock

1+ parts

$8.663

100+ parts

$8.230

1k+ parts

$7.797

10k+ parts

-

31

$8.663

$8.230

$7.797

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AZTECH Wire

Italy . 308 parts In-Stock

1+ parts

$10.827

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308

$10.827

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One Stop Electronics

USA . 838 parts In-Stock

1+ parts

$670.000

100+ parts

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838

$670.000

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Corphita

USA . 1,021 parts In-Stock

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1,021

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Overview

Upgrade your audio systems with the TCM2910AJ-00 by Texas Instruments, a top-quality Audio Codec designed for seamless performance. Manufactured by Texas Instruments, a trusted name in the industry, this product offers unparalleled value and benefits to customers looking to enhance their audio experience. With a wide range of applications in telecom and consumer electronics, this codec delivers clear, high-quality sound with ease. Don't settle for average audio quality - choose Texas Instruments for superior performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection, ensuring the codec is reliable in various operating conditions.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexible timing and data transfer, making it suitable for applications where synchronization may be challenging.

Companding Law: MU-LAW

The mu-law companding law is commonly used in telephone networks, providing efficient compression of voice signals without significant loss of quality.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable performance within a typical operating range, making it suitable for standard commercial applications.

Telecom IC Type: PCM CODEC

Being a PCM codec specifically designed for telecommunications, this product is optimized for encoding and decoding voice signals in communication systems.

Filter: YES

The presence of a filter helps in refining and enhancing the quality of the audio signals processed by the codec, ensuring clearer sound output.

Technical Specifications

Audio Codecs TCM2910AJ-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T24

Length:

32.05 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

24

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.715 mm

Maximum Supply Current:

21 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TCM2910AJ-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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