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TCM129C19N-10

Texas Instruments

TCM129C19N-10 by Texas Instruments

TCM129C19N-10 by Texas Instruments is an Audio Codec with 16 terminals, operating in synchronous mode. It has a companding law of MU-LAW and operates at industrial temperature grade. This PCM CODEC features a nominal voltage of 5V and max supply current of 14mA, suitable for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,183 parts In-Stock

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8,183

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Digiode

USA . 2,526 parts In-Stock

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2,526

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$7.473

100+ parts

-

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639

$7.473

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Parana Technologies

USA . 1,056 parts In-Stock

1+ parts

$10.860

100+ parts

$1,008.495

1k+ parts

$9.774

10k+ parts

-

1,056

$10.860

$1,008.495

$9.774

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DigiPath Technology Company

USA . 2,220 parts In-Stock

1+ parts

$11.958

100+ parts

$11.001

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-

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2,220

$11.958

$11.001

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ChromeModa Solutions

Germany . 5,758 parts In-Stock

1+ parts

$12.202

100+ parts

$10.006

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5,758

$12.202

$10.006

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IDEA Electronic Components Group

UK . 384 parts In-Stock

1+ parts

$12.202

100+ parts

$11.592

1k+ parts

$10.982

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384

$12.202

$11.592

$10.982

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Semicontronic

India . 424 parts In-Stock

1+ parts

$232.000

100+ parts

$226.200

1k+ parts

$225.040

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424

$232.000

$226.200

$225.040

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Ampacity Inc.

Singapore . 380 parts In-Stock

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$536.000

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380

$536.000

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One Stop Electronics

USA . 1,624 parts In-Stock

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$643.000

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1,624

$643.000

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Corphita

USA . 2,643 parts In-Stock

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2,643

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Corohmni

South Africa . 387 parts In-Stock

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387

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Overview

Experience superior audio quality and reliability with the TCM129C19N-10 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line Audio Codecs that are perfect for a wide range of applications. With its compact size, high temperature range, and low power consumption, this PCM CODEC offers unmatched value and performance. Upgrade your audio systems today with the TCM129C19N-10 and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the internal components of the audio codec.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient communication and synchronization with other devices in a system, enhancing overall performance.

No. of Terminals: 16

Having 16 terminals allows for a versatile range of connections and functionalities, making the audio codec suitable for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding operating conditions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides stable power to the audio codec, ensuring consistent and reliable operation.

Technical Specifications

Audio Codecs TCM129C19N-10 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

14 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM129C19N-10 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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