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TLV320AIC1109PBSG4

Texas Instruments

TLV320AIC1109PBSG4 by Texas Instruments

TLV320AIC1109PBSG4 by Texas Instruments is a 32-terminal audio codec with 15-bit linear coding and companding law A/MU-LAW. It operates synchronously at 3V, suitable for industrial applications like PCM codecs in telecom systems due to its compact square package and low supply current of 0.008 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,509 parts In-Stock

1+ parts

-

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7,509

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Digiode

USA . 3,325 parts In-Stock

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-

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3,325

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,860 parts In-Stock

1+ parts

$6.984

100+ parts

-

1k+ parts

$7.553

10k+ parts

-

1,860

$6.984

-

$7.553

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DigiPath Technology Company

USA . 877 parts In-Stock

1+ parts

$7.690

100+ parts

-

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877

$7.690

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ChromeModa Solutions

Germany . 6,955 parts In-Stock

1+ parts

$7.847

100+ parts

$6.435

1k+ parts

-

10k+ parts

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6,955

$7.847

$6.435

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IDEA Electronic Components Group

UK . 135 parts In-Stock

1+ parts

$7.847

100+ parts

-

1k+ parts

$7.062

10k+ parts

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135

$7.847

-

$7.062

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AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$16.191

100+ parts

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216

$16.191

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Ampacity Inc.

Singapore . 354 parts In-Stock

1+ parts

$79.000

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354

$79.000

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One Stop Electronics

USA . 1,246 parts In-Stock

1+ parts

$111.000

100+ parts

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1,246

$111.000

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Corphita

USA . 4,518 parts In-Stock

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4,518

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Overview

Experience the superior audio quality and precision engineering of Texas Instruments with the TLV320AIC1109PBSG4 Audio Codec. This innovative product is perfect for a wide range of applications, from telecommunications to consumer electronics. With advanced features like synchronous operation and compact packaging, this codec delivers exceptional performance while maintaining efficiency. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations. Elevate your audio experience with the TLV320AIC1109PBSG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, making it ideal for portable audio devices.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving space and enabling mass production.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise timing and synchronization, enhancing the overall performance of the audio codec.

Power Supplies (V): 3

The low power supply voltage of 3V makes the product energy-efficient and suitable for battery-powered devices, extending their battery life.

No. of Terminals: 32

The high number of terminals allows for versatile connectivity options and functionality, making the codec suitable for complex audio processing applications.

Operating Temperature Range: -40°C to 85°C

The wide operating temperature range makes the codec suitable for use in various environmental conditions, ensuring reliability and performance in extreme temperatures.

Filter: YES

The presence of a filter in the audio codec allows for the removal of unwanted noise and interference, resulting in clear and high-quality audio output.

Technical Specifications

Audio Codecs TLV320AIC1109PBSG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

5 mm

Linear Coding:

15-BIT

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP32,.28SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Maximum Supply Current:

.008 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLV320AIC1109PBSG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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