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TLV320AC36CDW

Texas Instruments

TLV320AC36CDW by Texas Instruments

TLV320AC36CDW by Texas Instruments is a 20-terminal audio codec with 13-bit linear coding and mu-law companding law. Operating at 3/5 V, it supports synchronous/asynchronous modes and has a max supply current of 7.5 mA. Ideal for PCM codec applications in commercial temperature grades, this small outline package measures 12.8mm x 7.5mm x 2.65mm and features gull wing terminals for surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,463 parts In-Stock

1+ parts

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4,463

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Vyrian

USA . 1,372 parts In-Stock

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1,372

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 462 parts In-Stock

1+ parts

$10.506

100+ parts

-

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462

$10.506

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Parana Technologies

USA . 910 parts In-Stock

1+ parts

$12.086

100+ parts

-

1k+ parts

$12.497

10k+ parts

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910

$12.086

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$12.497

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DigiPath Technology Company

USA . 1,986 parts In-Stock

1+ parts

$13.308

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1,986

$13.308

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ChromeModa Solutions

Germany . 5,287 parts In-Stock

1+ parts

$13.580

100+ parts

$11.136

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5,287

$13.580

$11.136

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IDEA Electronic Components Group

UK . 2,314 parts In-Stock

1+ parts

$13.580

100+ parts

$12.901

1k+ parts

$12.222

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2,314

$13.580

$12.901

$12.222

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One Stop Electronics

USA . 351 parts In-Stock

1+ parts

$192.000

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351

$192.000

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Ampacity Inc.

Singapore . 1,490 parts In-Stock

1+ parts

$742.000

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1,490

$742.000

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Corphita

USA . 1,675 parts In-Stock

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1,675

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Overview

Elevate your audio experience with the TLV320AC36CDW from Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers once again with this audio codec. Perfect for a variety of applications in the audio industry, this product offers exceptional value and benefits to customers. Whether you're looking for precise sound control or seamless integration, the TLV320AC36CDW provides unmatched performance and reliability. Upgrade your audio system today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable devices.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different system configurations.

No. of Terminals: 20

Having 20 terminals allows for a variety of connectivity options and features in the product.

Companding Law: MU-LAW

The use of mu-law companding law ensures high-quality audio compression and decompression, enhancing the overall audio performance.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making the product energy-efficient and reliable.

Technical Specifications

Audio Codecs TLV320AC36CDW attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

2 dB

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TLV320AC36CDW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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