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TP3054AJ

Texas Instruments

TP3054AJ by Texas Instruments

TP3054AJ by Texas Instruments is an Audio Codec with +-5V power supplies, 16 terminals, and CMOS technology. It operates b/w 0-70°C, uses MU-LAW companding law, and has a PCM CODEC for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,082 parts In-Stock

1+ parts

-

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7,082

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Digiode

USA . 2,520 parts In-Stock

1+ parts

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2,520

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,929 parts In-Stock

1+ parts

$8.481

100+ parts

-

1k+ parts

$9.134

10k+ parts

-

1,929

$8.481

-

$9.134

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DigiPath Technology Company

USA . 676 parts In-Stock

1+ parts

$9.338

100+ parts

-

1k+ parts

-

10k+ parts

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676

$9.338

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ChromeModa Solutions

Germany . 3,492 parts In-Stock

1+ parts

$9.529

100+ parts

$7.814

1k+ parts

-

10k+ parts

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3,492

$9.529

$7.814

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IDEA Electronic Components Group

UK . 1,278 parts In-Stock

1+ parts

$9.529

100+ parts

$9.053

1k+ parts

$8.576

10k+ parts

-

1,278

$9.529

$9.053

$8.576

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AZTECH Wire

Italy . 404 parts In-Stock

1+ parts

$14.873

100+ parts

-

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404

$14.873

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One Stop Electronics

USA . 1,430 parts In-Stock

1+ parts

$111.000

100+ parts

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1,430

$111.000

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Corphita

USA . 3,111 parts In-Stock

1+ parts

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3,111

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Enhance your audio experience with the TP3054AJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality audio codecs like the TP3054AJ for a wide range of applications. Offering reliable performance and advanced features, this product ensures crystal-clear sound and seamless integration. Elevate your audio projects with the TP3054AJ and enjoy the value, benefits, and advantages that come with choosing a trusted brand like Texas Instruments. Experience superior audio quality like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers excellent heat resistance and durability, making the codec suitable for a wide range of operating temperatures and environments.

Power Supplies (V): +-5

Supports dual power supply voltages of both +5V and -5V, providing flexibility in powering the codec in different systems.

No. of Terminals: 16

With 16 terminals, the codec offers a variety of input and output options, enabling versatile connectivity with other components in the audio system.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into existing audio systems, saving space and simplifying the installation process.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the codec can withstand prolonged use without overheating, ensuring reliable performance.

Companding Law: MU-LAW

The mu-law companding law offers a high signal-to-noise ratio and improved voice quality, making the codec ideal for telecommunications applications.

Technology: CMOS

CMOS technology enables low power consumption and high integration density, making the codec energy-efficient and compact.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with a wide range of audio systems and ICs, making the codec a versatile choice for various applications.

Filter: YES

The presence of a filter helps in noise reduction and signal processing, ensuring a clear and high-quality audio output from the codec.

Technical Specifications

Audio Codecs TP3054AJ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-XDIP-T16

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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