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PCM5310PAP

Texas Instruments

PCM5310PAP by Texas Instruments

PCM5310PAP by Texas Instruments is a 4-channel audio codec with 24-bit linear coding. It operates at -25 to 85°C, consuming 120mA at 3.3V. Suitable for ADPCM encoding in telecom applications, it features a quad-terminal package with gull-wing form and nickel-palladium-gold finish.

Median Price

$8.659

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,904 parts In-Stock

1+ parts

$8.659

100+ parts

$7.059

1k+ parts

$4.706

10k+ parts

-

3,904

$8.659

$7.059

$4.706

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,340 parts In-Stock

1+ parts

$8.226

100+ parts

-

1k+ parts

-

10k+ parts

-

2,340

$8.226

-

-

-

Vyrian

USA . 6,936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,936

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,860 parts In-Stock

1+ parts

$7.793

100+ parts

-

1k+ parts

-

10k+ parts

-

1,860

$7.793

-

-

-

Parana Technologies

USA . 164 parts In-Stock

1+ parts

$13.481

100+ parts

-

1k+ parts

$13.993

10k+ parts

-

164

$13.481

-

$13.993

-

DigiPath Technology Company

USA . 314 parts In-Stock

1+ parts

$14.844

100+ parts

-

1k+ parts

-

10k+ parts

-

314

$14.844

-

-

-

ChromeModa Solutions

Germany . 1,821 parts In-Stock

1+ parts

$15.147

100+ parts

$12.421

1k+ parts

-

10k+ parts

-

1,821

$15.147

$12.421

-

-

IDEA Electronic Components Group

UK . 1,175 parts In-Stock

1+ parts

$15.147

100+ parts

$14.390

1k+ parts

$13.632

10k+ parts

-

1,175

$15.147

$14.390

$13.632

-

Lixinc

USA . 16,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,592

-

-

-

-

Perfect Parts

USA . 654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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654

-

-

-

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A-Z Elektronik GmbH

Germany . 233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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233

-

-

-

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Kepictronics

USA . 155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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155

-

-

-

-

Overview

Elevate your audio experience with the PCM5310PAP from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This Audio Codec is perfect for a wide range of applications, providing customers with unparalleled value and benefits. Whether you're a music enthusiast or a tech-savvy professional, the PCM5310PAP offers exceptional performance and versatility that will exceed your expectations. Upgrade your audio game today with this cutting-edge product!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring easy handling and long-lasting performance.

Surface Mount: YES

Being surface mountable allows for easier and more efficient integration into electronic circuits, saving space and making assembly simpler.

Output Code: BINARY/TWOS COMP

The binary/twos complement output code ensures accurate and high-resolution representation of audio data, resulting in clear and precise sound reproduction.

Package Shape: SQUARE

The square package shape facilitates easy placement on circuit boards, optimizing space utilization and improving overall design aesthetics.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for independent operation and communication with other components, enhancing flexibility and compatibility in various systems.

Input Code: BINARY/TWOS COMP

Using binary/twos complement input code ensures consistency and accuracy in signal processing tasks, leading to reliable audio encoding and decoding.

No. of Terminals: 64

Having 64 terminals provides sufficient connectivity options for interfacing with other devices and components, allowing for versatile audio codec applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The variety of package styles offers flexibility in choosing the most suitable form factor for specific design requirements, enhancing compatibility and ease of installation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand extended periods of use under challenging environmental conditions without compromising performance.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25°C ensures reliable operation even in colder environments, making the product suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides enhanced conductivity and corrosion resistance, ensuring reliable electrical connections for optimal audio performance.

Terminal Position: QUAD

The quad terminal position facilitates secure mounting and stable connections on circuit boards, reducing the risk of signal interference and improving overall product durability.

Output (V): VOLTAGE

The voltage output allows for flexible signal processing and compatibility with a wide range of audio equipment, enabling seamless integration into various audio systems.

Linear Coding: 24-BIT

The 24-bit linear coding ensures high-resolution audio encoding and decoding, resulting in accurate and detailed sound reproduction with minimal distortion.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm enables compact and low-profile design implementations, saving space and enhancing versatility in product integration.

Width: 10 mm

With a width of 10 mm, the product offers a balanced form factor that allows for easy handling and integration into various electronic systems and devices.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds ensures reliable soldering and assembly processes, contributing to the product's quality and longevity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables efficient and secure soldering of the product onto circuit boards, ensuring stable connections and optimal performance.

Length: 10 mm

Measuring 10 mm in length, the product offers a compact footprint that is suitable for space-constrained applications while maintaining functionality and performance.

No. of Channels: 4

Having 4 channels allows for multi-channel audio processing and playback, enabling the product to handle complex audio signals and deliver immersive sound experiences.

Terminal Form: GULL WING

The gull-wing terminal form ensures secure mounting and efficient soldering onto circuit boards, enhancing the product's durability and reliability in various operating conditions.

Maximum Supply Current: 120 mA

With a maximum supply current of 120 mA, the product operates efficiently without excessive power consumption, making it suitable for a wide range of audio applications.

Telecom IC Type: ADPCM CODEC

Being an ADPCM codec, the product supports efficient audio compression and decompression techniques, resulting in optimized data transmission and storage for telecommunications applications.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, the product offers standardized power requirements for seamless integration into electronic systems, ensuring consistent and reliable performance.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch provides precise and compact terminal spacing, allowing for secure connections and efficient signal transfer, enhancing the product's overall reliability.

Resolution (um): 24

The 24 um resolution ensures fine audio detail and clarity in signal processing, resulting in high-quality sound reproduction and accurate audio playback.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, allowing the product to be safely handled and stored under controlled environmental conditions to prevent damage.

Input Type: SINGLE-ENDED

Supporting single-ended input type simplifies connectivity and signal processing tasks, making the product easy to use and compatible with a wide range of audio devices.

Filter: YES

The presence of a filter enhances signal clarity and quality by eliminating unwanted noise and interference, ensuring optimal audio performance and fidelity.

Technical Specifications

Audio Codecs PCM5310PAP attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

Input Code:

BINARY/TWOS COMP

Input Type:

SINGLE-ENDED

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Linear Coding:

24-BIT

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

64

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output (V):

VOLTAGE

Output Code:

BINARY/TWOS COMP

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Resolution (um):

24

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

120 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

PCM5310PAP Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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