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ETC5057N-X

STMicroelectronics

ETC5057N-X by STMicroelectronics

ETC5057N-X by STMicroelectronics is an Audio Codec with 16 terminals, operating at -40 to 85 °C. It has a supply voltage of +-5V and max current of 11mA. Ideal for PCM CODEC applications in industrial telecom systems due to A-LAW companding law and synchronous/asynchronous operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,802 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,802

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-

-

-

Vyrian

USA . 980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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980

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Anansix

USA . 137 parts In-Stock

1+ parts

-

100+ parts

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137

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,738 parts In-Stock

1+ parts

$7.230

100+ parts

-

1k+ parts

$6.507

10k+ parts

-

1,738

$7.230

-

$6.507

-

MKK Technologies

India . 835 parts In-Stock

1+ parts

$13.596

100+ parts

-

1k+ parts

-

10k+ parts

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835

$13.596

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DigiPath Technology Company

USA . 835 parts In-Stock

1+ parts

$13.596

100+ parts

-

1k+ parts

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10k+ parts

-

835

$13.596

-

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Native Components

USA . 869 parts In-Stock

1+ parts

$20.040

100+ parts

-

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10k+ parts

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869

$20.040

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Northwest PG Solutions

USA . 1,763 parts In-Stock

1+ parts

$22.044

100+ parts

$19.840

1k+ parts

-

10k+ parts

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1,763

$22.044

$19.840

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-

Corphita

USA . 3,788 parts In-Stock

1+ parts

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100+ parts

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3,788

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Parana Technologies

USA . 1,845 parts In-Stock

1+ parts

-

100+ parts

$8.645

1k+ parts

-

10k+ parts

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1,845

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$8.645

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Overview

Unlock the power of high-quality audio with the ETC5057N-X by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch Audio Codecs like this one that offer exceptional performance and reliability. Perfect for telecommunications applications, this product boasts seamless operation in both synchronous and asynchronous modes, providing customers with a versatile solution for their audio needs. With a compact design and industrial-grade temperature tolerance, the ETC5057N-X is the ideal choice for those seeking a dependable and efficient PCM CODEC. Elevate your audio experience with STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Having both operating modes provides flexibility in different systems and applications.

Power Supplies (V): +-5

The wide power supply range allows compatibility with various power sources.

No. of Terminals: 16

Sufficient terminals provide ample connectivity options for integration into different systems.

Package Style (Meter): IN-LINE

The in-line package style saves space and is suitable for applications where compact size is crucial.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can operate reliably in diverse environments.

Minimum Operating Temperature: -40 °C

The product can withstand low temperatures without compromising performance.

Terminal Finish: TIN LEAD

Tin lead finish ensures good conductivity and solderability for reliable connections.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage is common and easily available, simplifying power requirements.

Filter: YES

Having a built-in filter helps in improving the audio signal quality by reducing noise and interference.

Technical Specifications

Audio Codecs ETC5057N-X attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Codecs

Maximum Supply Current:

11 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

ETC5057N-X Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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