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TP3067ADWR

Texas Instruments

TP3067ADWR by Texas Instruments

TP3067ADWR by Texas Instruments is a PCM CODEC with A-LAW companding law. It operates in SYNCHRONOUS/ASYNCHRONOUS mode, has 20 terminals, and supports -5V to 5V supply voltage range. This small outline package is ideal for telecom applications requiring audio codecs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,396 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,396

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-

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Digiode

USA . 2,922 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,922

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,175 parts In-Stock

1+ parts

$9.846

100+ parts

-

1k+ parts

$10.413

10k+ parts

-

2,175

$9.846

-

$10.413

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DigiPath Technology Company

USA . 2,294 parts In-Stock

1+ parts

$10.842

100+ parts

-

1k+ parts

-

10k+ parts

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2,294

$10.842

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-

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ChromeModa Solutions

Germany . 2,761 parts In-Stock

1+ parts

$11.063

100+ parts

$9.072

1k+ parts

-

10k+ parts

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2,761

$11.063

$9.072

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IDEA Electronic Components Group

UK . 178 parts In-Stock

1+ parts

$11.063

100+ parts

$10.510

1k+ parts

$9.957

10k+ parts

-

178

$11.063

$10.510

$9.957

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AZTECH Wire

Italy . 295 parts In-Stock

1+ parts

$16.129

100+ parts

-

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10k+ parts

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295

$16.129

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One Stop Electronics

USA . 297 parts In-Stock

1+ parts

$334.000

100+ parts

-

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10k+ parts

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297

$334.000

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Corphita

USA . 2,442 parts In-Stock

1+ parts

-

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2,442

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Overview

Enhance your audio experience with the TP3067ADWR by Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers cutting-edge audio codecs that deliver unmatched performance. Perfect for a wide range of applications, this PCM codec is ideal for telecom systems, providing crystal-clear sound and seamless operation. With a compact design and advanced technology, this codec ensures optimal functionality while maintaining a user-friendly interface. Upgrade your audio system today with the TP3067ADWR and enjoy the benefits of top-notch performance and exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable makes it easier to integrate into electronic circuits and saves space.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The flexibility of operating in synchronous or asynchronous mode allows for compatibility with different systems.

No. of Terminals: 20

Having 20 terminals provides a wide range of connectivity options for various components.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in a variety of environments.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Audio Codecs TP3067ADWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TP3067ADWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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