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TCM129C17ADW

Texas Instruments

TCM129C17ADW by Texas Instruments

TCM129C17ADW by Texas Instruments is an Audio Codec with 16 terminals, operating at -40 to 85°C. It features A-LAW companding law, synchronous/asynchronous mode, and +-5V power supplies. Ideal for telecom applications requiring PCM CODECs in industrial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,503

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-

-

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Digiode

USA . 1,979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,979

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 888 parts In-Stock

1+ parts

$5.454

100+ parts

$506.479

1k+ parts

$4.909

10k+ parts

-

888

$5.454

$506.479

$4.909

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DigiPath Technology Company

USA . 717 parts In-Stock

1+ parts

$6.005

100+ parts

-

1k+ parts

-

10k+ parts

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717

$6.005

-

-

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ChromeModa Solutions

Germany . 5,213 parts In-Stock

1+ parts

$6.128

100+ parts

$5.025

1k+ parts

-

10k+ parts

-

5,213

$6.128

$5.025

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IDEA Electronic Components Group

UK . 1,285 parts In-Stock

1+ parts

$6.128

100+ parts

-

1k+ parts

$5.515

10k+ parts

-

1,285

$6.128

-

$5.515

-

AZTECH Wire

Italy . 892 parts In-Stock

1+ parts

$7.863

100+ parts

-

1k+ parts

-

10k+ parts

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892

$7.863

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-

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One Stop Electronics

USA . 1,257 parts In-Stock

1+ parts

$600.000

100+ parts

-

1k+ parts

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10k+ parts

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1,257

$600.000

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-

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Corphita

USA . 824 parts In-Stock

1+ parts

-

100+ parts

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824

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Overview

Enhance your audio experience with the TCM129C17ADW from Texas Instruments, a leading manufacturer known for top-quality products. This Audio Codec offers seamless integration in a compact package, making it ideal for a wide range of applications. With its synchronous/asynchronous operation and A-law companding law, this product provides exceptional value and benefits to customers seeking reliable and high-performance audio solutions. Upgrade your audio system with the TCM129C17ADW and enjoy superior sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

This feature allows for easy installation and space-saving design of the product.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in synchronous or asynchronous mode provides flexibility in various applications.

No. of Terminals: 16

A higher number of terminals allow for more connectivity options and versatility in usage.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance under challenging conditions.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity.

Technical Specifications

Audio Codecs TCM129C17ADW attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.08 dB

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM129C17ADW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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