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TLC32044MJ

Texas Instruments

TLC32044MJ by Texas Instruments

TLC32044MJ by Texas Instruments is a 14-bit PCM CODEC with synchronous/asynchronous operation, -55 to 125 °C temp range, and ±5 V supplies. Ideal for military telecom applications due to its ceramic package, through-hole terminals, and built-in filter for audio processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,161 parts In-Stock

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Digiode

USA . 4,871 parts In-Stock

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4,871

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Distributors (Availability)

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Parana Technologies

USA . 1,961 parts In-Stock

1+ parts

$6.453

100+ parts

-

1k+ parts

$7.196

10k+ parts

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1,961

$6.453

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$7.196

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DigiPath Technology Company

USA . 1,892 parts In-Stock

1+ parts

$7.106

100+ parts

$6.538

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-

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1,892

$7.106

$6.538

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ChromeModa Solutions

Germany . 3,822 parts In-Stock

1+ parts

$7.251

100+ parts

$5.946

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3,822

$7.251

$5.946

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IDEA Electronic Components Group

UK . 841 parts In-Stock

1+ parts

$7.251

100+ parts

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$6.526

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841

$7.251

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$6.526

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AZTECH Wire

Italy . 656 parts In-Stock

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$10.915

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656

$10.915

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One Stop Electronics

USA . 587 parts In-Stock

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$988.000

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587

$988.000

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Corphita

USA . 2,995 parts In-Stock

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2,995

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Overview

Elevate your audio experience with the TLC32044MJ from Texas Instruments, a leading manufacturer known for high-quality components. As part of the Audio Codecs category, this PCM CODEC offers unparalleled sound clarity and precision. Ideal for military-grade applications, this versatile chip operates in both synchronous and asynchronous modes, providing flexibility and reliability. With a compact package design and low power consumption, the TLC32044MJ delivers exceptional value and performance, making it the perfect choice for your next audio project. Upgrade your audio solutions today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the internal components, making this product suitable for rugged environments.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The synchronous/asynchronous operating mode provides flexibility in how the audio codec can be integrated into different systems, making it versatile for various applications.

Power Supplies (V): +-5

The dual power supplies of +-5V allow for stable and balanced power distribution, enhancing the overall performance and efficiency of the audio codec.

No. of Terminals: 28

The high number of terminals enables the audio codec to connect with multiple components or interfaces, expanding its compatibility and functionality.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability and resilience in challenging environments where heat may be a factor.

Technology: CMOS

The CMOS technology used in this audio codec offers low power consumption and high noise immunity, contributing to improved performance and efficiency.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures consistent and stable power delivery, which is crucial for maintaining the integrity of audio signals and data transmission.

Filter: YES

The presence of a filter enhances the audio quality by removing unwanted noise and interference, resulting in clearer and more precise sound output.

Technical Specifications

Audio Codecs TLC32044MJ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

R-GDIP-T28

Linear Coding:

14-BIT

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.715 mm

Sub-Category:

Codecs

Maximum Supply Current:

40 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TLC32044MJ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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