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ETC5064N

STMicroelectronics

ETC5064N by STMicroelectronics

STMicroelectronics ETC5064N is an Audio Codec with +-5V power supplies, 20 terminals, and 70 °C max operating temp. It features MU-LAW companding law, PCM CODEC for telecom applications, and a CMOS technology suitable for commercial temperature grade usage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,901 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,901

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Digiode

USA . 4,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,852

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Anansix

USA . 2,392 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,392

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 209 parts In-Stock

1+ parts

$11.362

100+ parts

-

1k+ parts

$10.226

10k+ parts

-

209

$11.362

-

$10.226

-

MKK Technologies

India . 1,889 parts In-Stock

1+ parts

$21.366

100+ parts

-

1k+ parts

-

10k+ parts

-

1,889

$21.366

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DigiPath Technology Company

USA . 1,889 parts In-Stock

1+ parts

$21.366

100+ parts

-

1k+ parts

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10k+ parts

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1,889

$21.366

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Corphita

USA . 2,016 parts In-Stock

1+ parts

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2,016

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Parana Technologies

USA . 1,645 parts In-Stock

1+ parts

-

100+ parts

$13.585

1k+ parts

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10k+ parts

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1,645

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$13.585

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Kepictronics

USA . 940 parts In-Stock

1+ parts

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940

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Native Components

USA . 753 parts In-Stock

1+ parts

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753

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Northwest PG Solutions

USA . 317 parts In-Stock

1+ parts

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317

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Overview

Get ready to experience crystal-clear audio like never before with the ETC5064N by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics has created an Audio Codec that delivers top-quality sound in a compact and easy-to-use package. Ideal for a wide range of applications, this PCM CODEC is perfect for everything from telecom systems to consumer electronics. Bring your projects to life with the ETC5064N's reliable performance, versatility, and cutting-edge technology. Elevate your audio experience today with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and lightweight design for easy handling and installation.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient packaging and placement within a circuit or system.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for both synchronous and asynchronous operation provides flexibility in different system setups and communication protocols.

Power Supplies (V): +-5

Wide power supply range of +-5V allows for compatibility with various power sources and environments.

No. of Terminals: 20

Sufficient number of terminals for connecting to other components and peripherals, enabling versatile integration.

Package Style (Meter): IN-LINE

In-line package style simplifies PCB layout and wiring, optimizing space usage and assembly efficiency.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding operating conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in a wide range of environments without compromising functionality.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability, ensuring secure connections and signal transmission.

Terminal Position: DUAL

Dual terminal position allows for increased flexibility in PCB layout and connection orientation.

Maximum Seated Height: 3.93 mm

Low profile design with maximum seated height of 3.93mm enables compact and space-saving installation.

Width: 7.62 mm

Narrow width of 7.62mm facilitates easy integration into tight spaces or alongside other components.

Companding Law: MU-LAW

Utilizing MU-LAW companding law ensures high-quality audio compression and expansion, preserving sound fidelity during transmission.

Length: 25.15 mm

Optimal length of 25.15mm for accommodating necessary circuitry and features without creating excess size.

Temperature Grade: COMMERCIAL

Commercial temperature grade certification indicates standard performance and reliability for general commercial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Nominal Negative Supply Voltage: -5 V

Stable nominal negative supply voltage of -5V ensures consistent operation and signal integrity.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and robust connections for reliable signal transmission and durability.

Maximum Supply Current: 10 mA

Low maximum supply current of 10mA minimizes power consumption and heat generation, enhancing energy efficiency.

Telecom IC Type: PCM CODEC

Defined as a Pulse Code Modulation (PCM) Codec, offering efficient coding and decoding of analog audio signals for telecommunications applications.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V ensures consistent and reliable performance within specified operating parameters.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm facilitates ease of assembly and compatibility with common electronic components.

Maximum Gain Tolerance: 0.15 dB

Precise maximum gain tolerance of 0.15dB allows for accurate audio processing and output control.

Filter: YES

Inclusion of a filter enhances audio quality by reducing noise and unwanted frequencies in the signal output.

Technical Specifications

Audio Codecs ETC5064N attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

25.15 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Codecs

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

ETC5064N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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