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TLV320AC40IPTR

Texas Instruments

TLV320AC40IPTR by Texas Instruments

TLV320AC40IPTR by Texas Instruments is an Audio Codec with 48 terminals, operating at -40 to 85°C. It features companding law MU-LAW and operates on a 3V supply voltage. Ideal for PCM CODEC applications in industrial settings due to its compact flatpack design and low profile.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,501 parts In-Stock

1+ parts

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4,501

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Digiode

USA . 2,113 parts In-Stock

1+ parts

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2,113

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,379 parts In-Stock

1+ parts

$13.203

100+ parts

$1,226.113

1k+ parts

$11.883

10k+ parts

-

1,379

$13.203

$1,226.113

$11.883

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AZTECH Wire

Italy . 206 parts In-Stock

1+ parts

$13.453

100+ parts

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206

$13.453

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DigiPath Technology Company

USA . 787 parts In-Stock

1+ parts

$14.538

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787

$14.538

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ChromeModa Solutions

Germany . 1,183 parts In-Stock

1+ parts

$14.835

100+ parts

$12.165

1k+ parts

-

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1,183

$14.835

$12.165

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IDEA Electronic Components Group

UK . 201 parts In-Stock

1+ parts

$14.835

100+ parts

$14.093

1k+ parts

$13.352

10k+ parts

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201

$14.835

$14.093

$13.352

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One Stop Electronics

USA . 931 parts In-Stock

1+ parts

$254.000

100+ parts

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931

$254.000

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Corphita

USA . 911 parts In-Stock

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911

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Overview

Unlock the ultimate audio experience with the TLV320AC40IPTR by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability in their products. The TLV320AC40IPTR is a game-changer in the Audio Codecs category, offering seamless synchronization, versatile operating modes, and a compact package design. Perfect for applications in telecommunications and multimedia devices, this PCM CODEC delivers exceptional performance and efficiency. Elevate your audio projects with the TLV320AC40IPTR and enjoy unparalleled value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

Surface mount design allows for easy installation and saves space on PCB.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Supports both synchronous and asynchronous operation, providing flexibility in different audio applications.

No. of Terminals: 48

Large number of terminals allow for versatile connectivity options in audio systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in a variety of environmental conditions.

Companding Law: MU-LAW

Mu-law companding law helps in reducing quantization noise in audio signals, resulting in better audio quality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Nominal Supply Voltage: 3 V

Operates at a low nominal supply voltage, suitable for battery-powered audio devices.

Filter: YES

Built-in filter helps in removing unwanted noise from audio signals, ensuring clean and clear sound output.

Technical Specifications

Audio Codecs TLV320AC40IPTR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLV320AC40IPTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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