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TCM320AC40CN

Texas Instruments

TCM320AC40CN by Texas Instruments

Texas Instruments TCM320AC40CN is a 20-terminal PCM CODEC with A-LAW companding law. It operates in synchronous/asynchronous mode, with 13-bit linear coding and a max supply current of 7.5 mA at 3V nominal voltage. This Audio Codec has a rectangular package style, ideal for telecom applications requiring filtering capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,437 parts In-Stock

1+ parts

-

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7,437

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Digiode

USA . 2,832 parts In-Stock

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2,832

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 54 parts In-Stock

1+ parts

$2.579

100+ parts

-

1k+ parts

$3.072

10k+ parts

-

54

$2.579

-

$3.072

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DigiPath Technology Company

USA . 361 parts In-Stock

1+ parts

$2.840

100+ parts

$2.613

1k+ parts

-

10k+ parts

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361

$2.840

$2.613

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ChromeModa Solutions

Germany . 2,935 parts In-Stock

1+ parts

$2.898

100+ parts

$2.376

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-

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2,935

$2.898

$2.376

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IDEA Electronic Components Group

UK . 2,347 parts In-Stock

1+ parts

$2.898

100+ parts

-

1k+ parts

$2.608

10k+ parts

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2,347

$2.898

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$2.608

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AZTECH Wire

Italy . 524 parts In-Stock

1+ parts

$4.973

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524

$4.973

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One Stop Electronics

USA . 1,302 parts In-Stock

1+ parts

$248.000

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1,302

$248.000

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Corphita

USA . 1,480 parts In-Stock

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1,480

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Overview

Upgrade your audio systems with the Texas Instruments TCM320AC40CN, a high-quality Audio Codec designed to deliver exceptional sound performance. As a leader in semiconductor manufacturing, Texas Instruments ensures reliability and innovation in every product. Ideal for telecom applications, this PCM CODEC offers seamless synchronous/asynchronous operation and precise 13-bit linear coding. With its compact design and A-LAW companding law, the TCM320AC40CN provides customers with unmatched value and versatility. Experience superior audio quality and efficiency with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the audio codec, ensuring a longer lifespan.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The flexibility of operating in both synchronous and asynchronous modes allows for compatibility with a wide range of systems and devices.

No. of Terminals: 20

Having 20 terminals allows for a variety of connections and interfaces, making the audio codec versatile and adaptable to different setups.

Linear Coding: 13-BIT

With 13-bit linear coding, this audio codec can provide high-resolution audio data, resulting in clear and detailed sound reproduction.

Companding Law: A-LAW

The A-Law companding law helps in reducing quantization distortion and improves the dynamic range of the audio codec, resulting in better audio quality.

Technology: CMOS

Being based on CMOS technology, this audio codec offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Maximum Supply Current: 7.5 mA

The low maximum supply current requirement of 7.5 mA makes this audio codec suitable for battery-operated devices, extending their usage time.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V, this audio codec can be easily integrated into existing systems or powered using standard voltage sources.

Filter: YES

Having a filter included in the audio codec helps in noise reduction and signal refinement, ensuring high-quality audio output.

Technical Specifications

Audio Codecs TCM320AC40CN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM320AC40CN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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