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TLV320AIC15CDBTRG4

Texas Instruments

TLV320AIC15CDBTRG4 by Texas Instruments

TLV320AIC15CDBTRG4 by Texas Instruments is a 30-terminal audio codec with 2 channels, operating at 1.8-3.3V. It features two's complement output/input codes, synchronous operation, and CMOS technology. Ideal for telecom applications requiring programmable codecs with single-ended/differential inputs and filters.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,251 parts In-Stock

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Digiode

USA . 4,822 parts In-Stock

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4,822

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Distributors (Availability)

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AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$7.494

100+ parts

-

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423

$7.494

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Parana Technologies

USA . 399 parts In-Stock

1+ parts

$15.873

100+ parts

$1,474.063

1k+ parts

$14.286

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399

$15.873

$1,474.063

$14.286

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DigiPath Technology Company

USA . 609 parts In-Stock

1+ parts

$17.478

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609

$17.478

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ChromeModa Solutions

Germany . 1,696 parts In-Stock

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$17.835

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$14.625

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1,696

$17.835

$14.625

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IDEA Electronic Components Group

UK . 226 parts In-Stock

1+ parts

$17.835

100+ parts

$16.943

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$16.052

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226

$17.835

$16.943

$16.052

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One Stop Electronics

USA . 587 parts In-Stock

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$433.000

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587

$433.000

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Corphita

USA . 3,887 parts In-Stock

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Microchip USA

USA . 170 parts In-Stock

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170

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Overview

Experience crystal clear audio like never before with the TLV320AIC15CDBTRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality audio codecs that are perfect for a wide range of applications. Whether you're designing consumer electronics, telecommunications equipment, or automotive systems, this programmable codec offers unmatched value, benefits, and advantages. Upgrade your audio experience today with the TLV320AIC15CDBTRG4 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Output Code: TWOS COMPLEMENT

TWOS COMPLEMENT output code provides accurate representation of digital signals, ensuring high-quality audio output.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise synchronization of data transmission, reducing the chances of data loss or errors.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options, allowing flexibility in system design and compatibility with different power sources.

Maximum Output Voltage: 2.35 V

High maximum output voltage ensures strong and clear audio signals, suitable for various audio applications.

No. of Channels: 2

Dual-channel setup provides stereo sound output, enhancing the audio experience for the users.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for audio processing.

Technical Specifications

Audio Codecs TLV320AIC15CDBTRG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V DIGTAL SUPPLY, TLV320AIC15IDBTG4 THIS PART IS DELELTED FOR LEAF CLASS FIX

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

R-PDSO-G30

Length:

7.8 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

30

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP30,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TLV320AIC15CDBTRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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