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TCM29C13FKM

Texas Instruments

TCM29C13FKM by Texas Instruments

TCM29C13FKM by Texas Instruments is a PCM CODEC telecom IC with A/MU-LAW companding law. Operating in synchronous mode, it has 20 terminals and operates b/w -55 to 125 °C. This audio codec chip carrier is ideal for military-grade applications requiring filter technology in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,564 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,564

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Digiode

USA . 1,569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,569

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,111 parts In-Stock

1+ parts

$11.539

100+ parts

$1,071.557

1k+ parts

$10.385

10k+ parts

-

2,111

$11.539

$1,071.557

$10.385

-

DigiPath Technology Company

USA . 1,037 parts In-Stock

1+ parts

$12.706

100+ parts

$11.689

1k+ parts

-

10k+ parts

-

1,037

$12.706

$11.689

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ChromeModa Solutions

Germany . 5,304 parts In-Stock

1+ parts

$12.965

100+ parts

$10.631

1k+ parts

-

10k+ parts

-

5,304

$12.965

$10.631

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$12.965

100+ parts

$12.317

1k+ parts

$11.668

10k+ parts

-

2,087

$12.965

$12.317

$11.668

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AZTECH Wire

Italy . 245 parts In-Stock

1+ parts

$18.506

100+ parts

-

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10k+ parts

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245

$18.506

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One Stop Electronics

USA . 851 parts In-Stock

1+ parts

$904.000

100+ parts

-

1k+ parts

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10k+ parts

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851

$904.000

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Corphita

USA . 4,938 parts In-Stock

1+ parts

-

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4,938

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Overview

Experience superior audio quality and reliability with the TCM29C13FKM by Texas Instruments, a leading manufacturer in the industry. This advanced audio codec ensures crystal-clear sound in various applications, making it perfect for telecommunications, audio processing, and more. Trust in Texas Instruments' expertise to deliver top-notch performance and innovation. Upgrade your audio experience today with the TCM29C13FKM.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired body material ensures durability and reliable performance in various operating conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into electronic devices and circuit boards.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures accurate and synchronized data transmission, making it ideal for applications requiring precise timing.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and space-saving design, suitable for applications where size is a critical factor.

Nominal Supply Voltage: 5 V

With a 5V nominal supply voltage, this audio codec can be easily powered using standard sources, providing convenience and compatibility.

Technical Specifications

Audio Codecs TCM29C13FKM attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

TCM29C13FKM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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