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TCM2909N

Texas Instruments

TCM2909N by Texas Instruments

TCM2909N by Texas Instruments is an audio codec with +-5,12V power supplies and 22 terminals. It operates in a temperature range of 0-70°C, using MU-LAW companding law for PCM codec applications. This MOS technology device has a max supply current of 0.0445 mA and terminal pitch of 2.54mm, suitable for commercial telecom ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,970

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Digiode

USA . 3,688 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,688

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,506 parts In-Stock

1+ parts

$10.145

100+ parts

-

1k+ parts

$10.684

10k+ parts

-

1,506

$10.145

-

$10.684

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AZTECH Wire

Italy . 692 parts In-Stock

1+ parts

$11.129

100+ parts

-

1k+ parts

-

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692

$11.129

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DigiPath Technology Company

USA . 2,332 parts In-Stock

1+ parts

$11.171

100+ parts

-

1k+ parts

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10k+ parts

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2,332

$11.171

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ChromeModa Solutions

Germany . 6,127 parts In-Stock

1+ parts

$11.399

100+ parts

$9.347

1k+ parts

-

10k+ parts

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6,127

$11.399

$9.347

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IDEA Electronic Components Group

UK . 522 parts In-Stock

1+ parts

$11.399

100+ parts

$10.829

1k+ parts

$10.259

10k+ parts

-

522

$11.399

$10.829

$10.259

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One Stop Electronics

USA . 436 parts In-Stock

1+ parts

$914.000

100+ parts

-

1k+ parts

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10k+ parts

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436

$914.000

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Corphita

USA . 2,099 parts In-Stock

1+ parts

-

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2,099

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Overview

Enhance your audio experience with the TCM2909N by Texas Instruments. This top-notch Audio Codec boasts the quality and reliability that TI is known for, providing exceptional sound performance in a wide range of applications. Whether you're designing a new telecommunications system or upgrading your audio equipment, this PCM CODEC is the perfect choice. With its high value, low power consumption, and precise signal processing, the TCM2909N will exceed your expectations and take your audio projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable audio devices.

Power Supplies (V): +-5,12

The dual power supply options of +-5V and 12V offer flexibility in powering the device, making it compatible with a variety of systems.

No. of Terminals: 22

With 22 terminals, this codec provides multiple connection options for various input and output functionalities, enhancing its versatility.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in extended periods of use or in warm environments.

Companding Law: MU-LAW

The use of mu-law companding law helps in reducing noise and distortions, resulting in higher quality audio output.

Technology: MOS

The MOS technology offers low power consumption and high efficiency, making the codec suitable for energy-efficient audio devices.

Maximum Gain Tolerance: 0.1 dB

The minimal gain tolerance of 0.1 dB ensures precise and accurate audio signal amplification, maintaining audio fidelity.

Technical Specifications

Audio Codecs TCM2909N attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

NO

Maximum Gain Tolerance:

.1 dB

JESD-30 Code:

R-PDIP-T22

Linear Coding:

NOT AVAILABLE

No. of Functions:

1

No. of Terminals:

22

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP22,.4

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5,12

Qualification:

Not Qualified

Sub-Category:

Codecs

Maximum Supply Current:

.0445 mA

Surface Mount:

NO

Technology:

MOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TCM2909N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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