Loading...

TP3064BFNR

Texas Instruments

TP3064BFNR by Texas Instruments

TP3064BFNR by Texas Instruments is a 20-terminal PCM CODEC chip carrier with -5V to 5V supply, operating from 0°C to 70°C. It features companding law MU-LAW, synchronous/asynchronous modes, and includes a filter. Ideal for telecom applications requiring audio codecs in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,128

-

-

-

-

Digiode

USA . 4,035 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,035

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 269 parts In-Stock

1+ parts

$13.630

100+ parts

-

1k+ parts

$14.130

10k+ parts

-

269

$13.630

-

$14.130

-

DigiPath Technology Company

USA . 871 parts In-Stock

1+ parts

$15.009

100+ parts

$13.808

1k+ parts

-

10k+ parts

-

871

$15.009

$13.808

-

-

ChromeModa Solutions

Germany . 3,820 parts In-Stock

1+ parts

$15.315

100+ parts

$12.558

1k+ parts

-

10k+ parts

-

3,820

$15.315

$12.558

-

-

IDEA Electronic Components Group

UK . 2,221 parts In-Stock

1+ parts

$15.315

100+ parts

$14.549

1k+ parts

$13.784

10k+ parts

-

2,221

$15.315

$14.549

$13.784

-

AZTECH Wire

Italy . 278 parts In-Stock

1+ parts

$15.673

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$15.673

-

-

-

Ampacity Inc.

Singapore . 727 parts In-Stock

1+ parts

$61.000

100+ parts

-

1k+ parts

-

10k+ parts

-

727

$61.000

-

-

-

One Stop Electronics

USA . 1,038 parts In-Stock

1+ parts

$448.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,038

$448.000

-

-

-

Semicontronic

India . 907 parts In-Stock

1+ parts

$727.000

100+ parts

$708.825

1k+ parts

$705.190

10k+ parts

-

907

$727.000

$708.825

$705.190

-

Corphita

USA . 690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

690

-

-

-

-

Corohmni

South Africa . 107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

107

-

-

-

-

Overview

Upgrade your audio experience with the TP3064BFNR by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch audio codecs that are perfect for a wide range of applications. Whether you're looking to enhance the sound quality of your devices or improve communication systems, this PCM codec offers unmatched value and benefits. With its compact design, wide temperature range, and low power consumption, the TP3064BFNR is the perfect solution for all your audio needs. Trust Texas Instruments to deliver exceptional performance and reliability in every product they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, ensuring a long lifespan.

Surface Mount: YES

Easy to install and saves space on the circuit board, making it convenient for compact designs.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Provides flexibility in operation modes, accommodating different system requirements.

No. of Terminals: 20

Sufficient number of terminals for connecting various components, enhancing connectivity options.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, ensuring stable performance even in harsh environments.

Nominal Supply Voltage: 5 V

Standard voltage requirement for easier integration into existing systems.

Technical Specifications

Audio Codecs TP3064BFNR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

TP3064BFNR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20