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TCM29C17DW

Texas Instruments

TCM29C17DW by Texas Instruments

TCM29C17DW by Texas Instruments is a PCM CODEC with A-LAW companding law. Operating at +-5V, it has 16 terminals in a small outline package suitable for telecom applications. With synchronous mode and filter feature, it operates b/w 0-70°C in commercial grade CMOS technology.

Median Price

$4.580

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 524 parts In-Stock

1+ parts

$4.580

100+ parts

-

1k+ parts

-

10k+ parts

-

524

$4.580

-

-

-

Vyrian

USA . 8,878 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,878

-

-

-

-

Digiode

USA . 2,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,668

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 764 parts In-Stock

1+ parts

$7.721

100+ parts

-

1k+ parts

-

10k+ parts

-

764

$7.721

-

-

-

Parana Technologies

USA . 1,895 parts In-Stock

1+ parts

$13.782

100+ parts

-

1k+ parts

$14.267

10k+ parts

-

1,895

$13.782

-

$14.267

-

DigiPath Technology Company

USA . 225 parts In-Stock

1+ parts

$15.175

100+ parts

$13.961

1k+ parts

-

10k+ parts

-

225

$15.175

$13.961

-

-

ChromeModa Solutions

Germany . 5,830 parts In-Stock

1+ parts

$15.485

100+ parts

$12.698

1k+ parts

-

10k+ parts

-

5,830

$15.485

$12.698

-

-

IDEA Electronic Components Group

UK . 1,805 parts In-Stock

1+ parts

$15.485

100+ parts

$14.711

1k+ parts

$13.936

10k+ parts

-

1,805

$15.485

$14.711

$13.936

-

One Stop Electronics

USA . 1,005 parts In-Stock

1+ parts

$586.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,005

$586.000

-

-

-

Corphita

USA . 1,359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,359

-

-

-

-

Overview

Enhance your audio experience with the TCM29C17DW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This audio codec is perfect for applications such as telecommunication, providing seamless synchronous operation and precise companding law for optimal performance. With its compact design and wide temperature range, this product offers unmatched value and benefits to customers looking for superior audio solutions. Upgrade your audio system today with the TCM29C17DW and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Easily mountable on PCBs, making the installation process efficient and convenient.

Operating Mode: SYNCHRONOUS

Ensures synchronized operation with other components in the system, improving overall performance.

Power Supplies (V): +-5

Allows for flexibility in power input, making it compatible with a range of power sources.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and peripherals, enhancing connectivity options.

Filter: YES

Built-in filter improves audio quality by reducing noise and interference.

Technical Specifications

Audio Codecs TCM29C17DW attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.08 dB

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM29C17DW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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