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5962-9086303M3X

Texas Instruments

5962-9086303M3X by Texas Instruments

Texas Instruments' 5962-9086303M3X is an Audio Codec with synchronous/asynchronous operation, CMOS technology, and PCM CODEC type. It comes in a chip carrier package with 28 terminals and operates in industrial temperature range. Ideal for telecom applications requiring filtering capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,553 parts In-Stock

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6,553

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Digiode

USA . 2,052 parts In-Stock

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2,052

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Distributors (Availability)

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Parana Technologies

USA . 1,646 parts In-Stock

1+ parts

$6.327

100+ parts

-

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$7.076

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1,646

$6.327

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$7.076

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DigiPath Technology Company

USA . 2,310 parts In-Stock

1+ parts

$6.967

100+ parts

$6.409

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2,310

$6.967

$6.409

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ChromeModa Solutions

Germany . 2,581 parts In-Stock

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$7.109

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$5.829

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2,581

$7.109

$5.829

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IDEA Electronic Components Group

UK . 710 parts In-Stock

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$7.109

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$6.398

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710

$7.109

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$6.398

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AZTECH Wire

Italy . 549 parts In-Stock

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$11.799

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549

$11.799

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Native Components

USA . 684 parts In-Stock

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$25.054

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684

$25.054

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Northwest PG Solutions

USA . 134 parts In-Stock

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$27.560

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$24.804

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134

$27.560

$24.804

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One Stop Electronics

USA . 276 parts In-Stock

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$683.000

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276

$683.000

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Corphita

USA . 4,002 parts In-Stock

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Overview

Enhance your audio experiences with the 5962-9086303M3X by Texas Instruments. Crafted from high-quality ceramic, this PCM CODEC offers unparalleled sound clarity and precision. Whether you're designing a cutting-edge audio system or upgrading existing equipment, this chip carrier package guarantees seamless synchronous or asynchronous operation. Unlock new possibilities in telecommunications and digital audio processing with this versatile and reliable solution. Elevate your projects with the trusted technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body materials ensures durability and reliability for the product.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different system configurations.

No. of Terminals: 28

Having 28 terminals allows for a wide range of connectivity options and functionalities in the product.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and space-saving design for easy integration into various systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product is suitable for industrial environments where heat resistance is crucial.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the product ideal for use in harsh environmental conditions.

Terminal Position: QUAD

The quad terminal position allows for efficient connectivity and signal transmission within the product.

Maximum Seated Height: 2.03 mm

The low maximum seated height contributes to the product's compact design and easy integration into various applications.

Width: 11.43 mm

With a moderate width, the product offers a balance between compactness and functionality in its design.

Length: 11.43 mm

The product's length provides a compact form factor for easy installation and space-saving in different systems.

Temperature Grade: INDUSTRIAL

Being designed for industrial temperature ranges, the product can withstand harsh operating conditions and ensure reliable performance.

Technology: CMOS

Utilizing CMOS technology, the product offers low power consumption, high noise immunity, and compatibility with a wide range of systems.

Telecom IC Type: PCM CODEC

As a PCM Codec telecom IC type, the product provides high-quality audio encoding and decoding capabilities for telecommunications applications.

Terminal Pitch: 1.27 mm

The narrow terminal pitch enables efficient signal routing and connectivity within the product, enhancing its overall performance.

Filter: YES

Inclusion of a filter enhances signal processing and quality, making the product well-suited for audio encoding and decoding applications.

Technical Specifications

Audio Codecs 5962-9086303M3X attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

Length:

11.43 mm

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

5962-9086303M3X Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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