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TLV320AIC12KIRHBT

Texas Instruments

TLV320AIC12KIRHBT by Texas Instruments

TLV320AIC12KIRHBT by Texas Instruments is an Audio Codec with 2 channels, operating at -40 to 85°C. It features two's complement output/input codes, synchronous mode, and 1.8/3.3V power supplies. Ideal for telecom applications, this chip carrier has a very thin profile and nickel/palladium/gold terminal finish.

Median Price

$3.280

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 19 parts In-Stock

1+ parts

$0.527

100+ parts

-

1k+ parts

-

10k+ parts

-

19

$0.527

-

-

-

Rochester

USA . 2,541 parts In-Stock

1+ parts

$2.450

100+ parts

$2.400

1k+ parts

$2.350

10k+ parts

-

2,541

$2.450

$2.400

$2.350

-

Chip1Stop

Japan . 19 parts In-Stock

1+ parts

$3.280

100+ parts

-

1k+ parts

-

10k+ parts

-

19

$3.280

-

-

-

Texas Instruments

USA . 8,245 parts In-Stock

1+ parts

$5.086

100+ parts

$4.457

1k+ parts

$2.518

10k+ parts

-

8,245

$5.086

$4.457

$2.518

-

DigiKey

USA . 3 parts In-Stock

1+ parts

$6.760

100+ parts

$4.382

1k+ parts

-

10k+ parts

-

3

$6.760

$4.382

-

-

Verical

USA . 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,352 parts In-Stock

1+ parts

$0.501

100+ parts

-

1k+ parts

-

10k+ parts

-

4,352

$0.501

-

-

-

Vyrian

USA . 6,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,140

-

-

-

-

Chip Stock

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,675 parts In-Stock

1+ parts

$0.474

100+ parts

-

1k+ parts

-

10k+ parts

-

4,675

$0.474

-

-

-

Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

$5.888

100+ parts

$546.812

1k+ parts

$5.299

10k+ parts

-

1,380

$5.888

$546.812

$5.299

-

DigiPath Technology Company

USA . 2,284 parts In-Stock

1+ parts

$6.484

100+ parts

$5.965

1k+ parts

-

10k+ parts

-

2,284

$6.484

$5.965

-

-

ChromeModa Solutions

Germany . 4,522 parts In-Stock

1+ parts

$6.616

100+ parts

$5.425

1k+ parts

-

10k+ parts

-

4,522

$6.616

$5.425

-

-

IDEA Electronic Components Group

UK . 430 parts In-Stock

1+ parts

$6.616

100+ parts

-

1k+ parts

$5.954

10k+ parts

-

430

$6.616

-

$5.954

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Overview

Elevate your audio experience with the TLV320AIC12KIRHBT by Texas Instruments, a top-tier manufacturer in the industry. This Audio Codec is designed for seamless integration and superior performance in a variety of applications. Enjoy high-quality sound output, efficient power supplies, and a wide operating temperature range. With its compact package body material and advanced technology, this product offers unmatched value and benefits to our customers. Upgrade your audio solutions today with the TLV320AIC12KIRHBT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio devices.

Output Code: TWOS COMPLEMENT

The two's complement output code provides high resolution and accuracy in digital audio conversion.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and synchronization in data processing, resulting in high-quality audio output.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexibility in system design and compatibility with different power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Audio Codecs TLV320AIC12KIRHBT attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1 mm

Sub-Category:

Codecs

Maximum Supply Current:

2 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

TLV320AIC12KIRHBT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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