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TLV320AIC3106IRGZ

Texas Instruments

TLV320AIC3106IRGZ by Texas Instruments

TLV320AIC3106IRGZ by Texas Instruments is an Audio Codec with 48 terminals, operating at -40 to 85°C. It features synchronous mode, PCM codec for telecom applications, and a nominal voltage of 1.8V. Ideal for compact designs requiring high-quality audio processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,112 parts In-Stock

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5,112

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Digiode

USA . 2,081 parts In-Stock

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2,081

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Carlin Systems, Inc.

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 171 parts In-Stock

1+ parts

$6.137

100+ parts

$569.872

1k+ parts

$5.523

10k+ parts

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171

$6.137

$569.872

$5.523

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DigiPath Technology Company

USA . 28 parts In-Stock

1+ parts

$6.757

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28

$6.757

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IDEA Electronic Components Group

UK . 1,798 parts In-Stock

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$6.895

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$6.206

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1,798

$6.895

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$6.206

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ChromeModa Solutions

Germany . 1,613 parts In-Stock

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$6.895

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$5.654

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1,613

$6.895

$5.654

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AZTECH Wire

Italy . 268 parts In-Stock

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$17.608

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268

$17.608

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One Stop Electronics

USA . 286 parts In-Stock

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$419.000

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$419.000

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Lixinc

USA . 7,150 parts In-Stock

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Corphita

USA . 4,012 parts In-Stock

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4,012

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Overview

Upgrade your audio experience with the TLV320AIC3106IRGZ by Texas Instruments. This top-of-the-line Audio Codec boasts unparalleled quality and reliability that you can expect from a trusted manufacturer like Texas Instruments. Perfect for a wide range of applications in the audio industry, this product offers exceptional value, benefits, and advantages to customers looking to enhance their audio systems. Say goodbye to average sound quality and hello to superior audio performance with the TLV320AIC3106IRGZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to impact, making the product suitable for rugged industrial environments.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

Package Shape: SQUARE

Square package shape enables efficient use of space on the PCB, maximizing component density.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and precise data processing, making the product reliable for audio codec applications.

No. of Terminals: 48

The high number of terminals allows for versatile connectivity options, enabling the product to interface with various other components.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can function efficiently even in demanding industrial environments.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage minimizes power consumption, making the product energy-efficient and cost-effective.

Filter: YES

Presence of a filter enhances the audio quality by reducing noise and interference, ensuring clear and crisp sound output.

Technical Specifications

Audio Codecs TLV320AIC3106IRGZ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Filter:

YES

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLV320AIC3106IRGZ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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