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5962-9086302MXX

Texas Instruments

5962-9086302MXX by Texas Instruments

5962-9086302MXX by Texas Instruments is a MIL-STD-883 compliant PCM CODEC with CMOS technology. It operates in SYNCHRONOUS/ASYNCHRONOUS mode, has 28 terminals, and supports -5V to 5V supply voltage range. Ideal for military applications due to its ceramic package and wide temperature range of -55°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,034 parts In-Stock

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Digiode

USA . 2,846 parts In-Stock

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2,846

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Distributors (Availability)

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Native Components

USA . 135 parts In-Stock

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$0.272

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-

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$0.261

135

$0.272

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$0.261

Northwest PG Solutions

USA . 841 parts In-Stock

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$0.299

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$0.264

841

$0.299

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$0.264

Parana Technologies

USA . 66 parts In-Stock

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$11.091

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$11.552

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66

$11.091

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$11.552

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

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$12.462

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$11.839

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$11.216

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1,675

$12.462

$11.839

$11.216

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ChromeModa Solutions

Germany . 153 parts In-Stock

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$12.462

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$10.219

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153

$12.462

$10.219

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AZTECH Wire

Italy . 847 parts In-Stock

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$15.134

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847

$15.134

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One Stop Electronics

USA . 1,505 parts In-Stock

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$626.000

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$626.000

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Corphita

USA . 2,370 parts In-Stock

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2,370

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DigiPath Technology Company

USA . 2,193 parts In-Stock

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$11.236

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2,193

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Overview

Unleash the power of premium audio with Texas Instruments' 5962-9086302MXX! This top-notch Audio Codec delivers unparalleled quality and reliability, thanks to TI's renowned craftsmanship. Ideal for a wide range of applications, this product offers seamless synchronous/asynchronous operation in a MILITARY-grade package. With its cutting-edge technology and robust design, customers can expect nothing but exceptional performance and value. Upgrade your audio experience today with the 5962-9086302MXX by Texas Instruments!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides excellent durability and protection for the audio codec, making it suitable for rigorous industrial and military applications.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening level ensures high reliability and quality standards, making this audio codec a reliable choice for mission-critical applications.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for both synchronous and asynchronous operation modes offers flexibility in integration and compatibility with various systems, enhancing the versatility of this audio codec.

No. of Terminals: 28

With 28 terminals, this audio codec provides ample connectivity options for interfacing with other components and peripherals, facilitating seamless integration and versatility.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures stable performance even in demanding environments, making this audio codec suitable for diverse applications.

Package Style (Meter): IN-LINE

The in-line package style offers compact and space-efficient design, making this audio codec ideal for applications where size constraints are a concern.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high efficiency, making this audio codec a cost-effective and energy-efficient choice for various applications.

Technical Specifications

Audio Codecs 5962-9086302MXX attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

R-GDIP-T28

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.715 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

5962-9086302MXX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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