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TCM2201J

Texas Instruments

TCM2201J by Texas Instruments

Texas Instruments TCM2201J is an Audio Codec with 16 terminals in a ceramic rectangular package. Operating temperature ranges from -25°C to 85°C. Suitable for audio applications, utilizing CMOS technology and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,103 parts In-Stock

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Digiode

USA . 1,740 parts In-Stock

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1,740

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Distributors (Availability)

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Parana Technologies

USA . 1,199 parts In-Stock

1+ parts

$6.874

100+ parts

-

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$7.493

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1,199

$6.874

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$7.493

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DigiPath Technology Company

USA . 1,294 parts In-Stock

1+ parts

$7.570

100+ parts

$6.964

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1,294

$7.570

$6.964

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ChromeModa Solutions

Germany . 3,767 parts In-Stock

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$7.724

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$6.334

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3,767

$7.724

$6.334

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IDEA Electronic Components Group

UK . 564 parts In-Stock

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$7.724

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$6.952

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564

$7.724

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$6.952

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AZTECH Wire

Italy . 512 parts In-Stock

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$9.242

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512

$9.242

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One Stop Electronics

USA . 467 parts In-Stock

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$994.000

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467

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Corphita

USA . 1,345 parts In-Stock

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Overview

Experience crystal-clear audio quality with the TCM2201J by Texas Instruments, a leading manufacturer in the industry. Ideal for a wide range of applications, this audio codec offers unparalleled value and benefits to customers. Whether you're looking to enhance your sound system or improve communication devices, the TCM2201J delivers exceptional performance and reliability. Upgrade your audio experience today with this top-of-the-line product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer superior heat dissipation properties, ensuring optimal performance even at high operating temperatures.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space, making it easier to integrate into various electronic devices.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options, allowing for versatile audio codec applications.

Package Style (Meter): IN-LINE

In-line package style makes it convenient to mount the audio codec in a linear fashion, simplifying installation and layout design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this audio codec can withstand extended periods of use without overheating.

Minimum Operating Temperature: -25 °C

Having a low minimum operating temperature of -25°C ensures reliable performance even in colder environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures a stable connection, improving the overall reliability of the audio codec.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the audio codec energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals are robust and reliable, providing strong mechanical connections for long-term durability.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm offers compatibility with standard PCB layouts, facilitating easy integration and assembly.

Technical Specifications

Audio Codecs TCM2201J attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Codecs

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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