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TLV320AC40IPT

Texas Instruments

TLV320AC40IPT by Texas Instruments

TLV320AC40IPT by Texas Instruments is a 48-terminal audio codec with 13-bit linear coding, operating at 3V. It features companding law μ-law, synchronous/asynchronous mode, and filter. Ideal for telecom applications due to PCM CODEC type and industrial temperature grade.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,788 parts In-Stock

1+ parts

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4,788

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Vyrian

USA . 2,941 parts In-Stock

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2,941

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 518 parts In-Stock

1+ parts

$9.407

100+ parts

-

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518

$9.407

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Parana Technologies

USA . 435 parts In-Stock

1+ parts

$9.875

100+ parts

-

1k+ parts

$10.446

10k+ parts

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435

$9.875

-

$10.446

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DigiPath Technology Company

USA . 697 parts In-Stock

1+ parts

$10.874

100+ parts

$10.004

1k+ parts

-

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697

$10.874

$10.004

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ChromeModa Solutions

Germany . 1,416 parts In-Stock

1+ parts

$11.096

100+ parts

$9.099

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-

10k+ parts

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1,416

$11.096

$9.099

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IDEA Electronic Components Group

UK . 443 parts In-Stock

1+ parts

$11.096

100+ parts

$10.541

1k+ parts

$9.986

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443

$11.096

$10.541

$9.986

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One Stop Electronics

USA . 459 parts In-Stock

1+ parts

$134.000

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459

$134.000

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Corphita

USA . 4,950 parts In-Stock

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4,950

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Assy Fe

Spain . 15 parts In-Stock

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15

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Overview

Experience crystal clear audio quality with the TLV320AC40IPT from Texas Instruments, a leading manufacturer known for delivering top-notch products. As a high-performance audio codec in the industry-standard flatpack package, this versatile device offers synchronous/asynchronous operation and a mu-law companding law for optimal sound processing. Ideal for telecom applications, this innovative product provides customers with exceptional value, reliability, and precision in their audio system designs. Elevate your audio experience with the TLV320AC40IPT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection to the internal components of the audio codec, ensuring longevity and reliability.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The option to operate in either synchronous or asynchronous mode provides flexibility in different applications and allows for compatibility with various systems.

Power Supplies (V): 3

The low power supply requirement of 3V makes this audio codec energy-efficient and suitable for portable devices.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this audio codec can withstand harsh environmental conditions, making it suitable for industrial applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V ensures compatibility with standard power sources, making integration easier in various systems.

Technical Specifications

Audio Codecs TLV320AC40IPT attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLV320AC40IPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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